Watermark high-definition copperplate paper and manufacture technique thereof
A high-definition, manufacturing technology, applied in the direction of mechanical processing/deformation, coating, etc., can solve the problems of printing quality, printing cost, adaptability and anti-counterfeiting and anti-counterfeiting functions, uneven distribution of pulp fiber density, base paper base surface  Concave-convex uneven problem, to achieve the effect of low tightness, good for ink absorption, and thick coating
- Summary
 - Abstract
 - Description
 - Claims
 - Application Information
 
 AI Technical Summary 
Problems solved by technology
Method used
Examples
Embodiment Construction
[0015] The ink-absorbing layer coating mentioned in the operation 1. can be prepared according to the following weight component ratio:
[0016] Silica: 20-90 parts
[0017] China clay: 40-5 parts
[0018] Light calcium carbonate: 40-5 parts
[0019] Polyvinyl alcohol 10%: 50-170 parts
[0020] Vinyl acetate-ethylene copolymer emulsion: 35-80 parts
[0021] Cationic color fixing agent: 15-20 parts
[0022] Hexasulfonic acid: 3-6 parts
[0023] n-Butanol: 2-6 parts.
[0024] The ink-absorbing layer coating mentioned in the operation 1. can also be prepared according to the following weight component ratio:
[0025] Polyvinyl alcohol 10%: 50-80 parts
[0026] Silica: 30 parts
[0027] Polyvinylpyrrolidone 10%: 20-50 parts
[0028] Cationic color fixing agent: 5-10 parts
[0029] Hexasulfonic acid: 3-5 parts.
[0030] The average particle size of the above-mentioned silica is 2-9 µm.
[0031] The high-gloss layer coating mentioned in the above process ② is prepared ac...
PUM
| Property | Measurement | Unit | 
|---|---|---|
| particle size | aaaaa | aaaaa | 
Abstract
Description
Claims
Application Information
 Login to View More - R&D
 - Intellectual Property
 - Life Sciences
 - Materials
 - Tech Scout
 
- Unparalleled Data Quality
 - Higher Quality Content
 - 60% Fewer Hallucinations
 
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com