Making method for circuit board

The embodiment of the invention provides a manufacturing method of a circuit board, which comprises the steps as follows: a core layer is provided, which comprises a first dielectric layer, a first metal layer and a second metal layer; a through hole is formed on the core layer; the core layer is arranged on a support board, an in-built element is arranged in the through hole, the second metal layer contacts with the support board, the in-built element is provided with at least one electrode contact, which contacts with the support board; the in-built element is fixed in the through hole; the support board is removed; the first metal layer and the second metal layer are removed, the thickness of the electrode contact of the in-built element is lessened; a third metal layer and a fourth metal layer are formed respectively, wherein, the fourth metal layer is electrically connected with the electrode contact of the in-built element; the third metal layer and the fourth metal layer are patterned, thereby forming a first patterned wiring layer and a second patterned wiring layer. The embodiment of the invention can lessen the thickness of an electrode contact of an in-built element through a reduction technique.