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Grinding device for high-precision ultrathin wafer

A high-precision, ultra-thin technology, used in grinding machine parts, grinding/polishing equipment, shafts and bearings, etc., can solve problems such as unfavorable high-precision and ultra-thin processing of semiconductor wafers, and achieve small gaps and precision. High and low friction loss effect

Inactive Publication Date: 2011-09-07
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, whether it is supported by rolling bearings or static pressure gas bearings with small holes, it is not conducive to the high-precision and ultra-thin processing of semiconductor wafers.

Method used

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  • Grinding device for high-precision ultrathin wafer
  • Grinding device for high-precision ultrathin wafer
  • Grinding device for high-precision ultrathin wafer

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Experimental program
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Embodiment Construction

[0010] The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0011] like figure 1 and figure 2 As shown, a grinding device for high-precision and ultra-thin wafers of the present invention includes a bearing, a housing 1, a grinding wheel 10, a grinding wheel disc 11, a main shaft 13, a cooling water jacket 23, a motor stator 24 and a motor rotor 25 . Bearing, shell 1, emery wheel disc 11, main shaft 13, cooling water jacket 23, motor stator 24 and motor rotor 25 are coaxial. The shell 1 is a cylindrical body with coaxial through holes at the top and bottom. The housing 1 is provided with a cooling water inlet 22 and a cooling water outlet 2 . A cooling water jacket 23 is embedded in the upper inner wall of the casing 1 , and the cooling water inlet 22 and the cooling water outlet 2 communicate with the cooling water jacket 23 respectively. The cooling water jacket 23 is sleeved on the circumfer...

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Abstract

The invention discloses a grinding device for a high-precision ultrathin wafer, comprising a bearing, a shell, a grinding wheel, a grinding wheel disk, a spindle, a cooling water jacket, a motor stator, a motor rotator and a seal ring, wherein the bearing is a gas bearing composed of an upper ring sheet, a middle ring sheet, a lower ring sheet and a hollow pipe; the upper ring sheet and the lowerring sheet are respectively provided with an air inflow through hole, and a porous material layer is arranged in the air inflow through hole; the hollow pipe is provided with throttling through holes; each throttling through hole is provided with a choke; the inner wall of the middle of the hollow pipe is provided with a vent slot; a vent hole is arranged in the middle ring sheet; the shell is provided with an air outlet; and the vent slot is communicated with the outer environment via the vent hole and the air outlet. The bearing in the grinding device of the structure has the advantages of high axial bearing force and rigidity, low bearing abrasion loss and high precision and can satisfy the technical requirements of the high-precision ultrathin wafer.

Description

technical field [0001] The invention belongs to the field of semiconductor wafer manufacturing equipment, and in particular relates to a grinding device for high-precision and ultra-thin wafers. Background technique [0002] Semiconductor wafers are typical hard and brittle materials, and high-precision and ultra-thin grinding must use high-rigidity and high-precision grinding devices. The spindle in traditional wafer grinding devices is supported by rolling bearings or small-bore throttle hydrostatic gas bearings. Because the friction of the rolling bearing belongs to the rolling friction between the roller and the outer ring and the inner ring, the calorific value is large and the friction loss is serious, so the rolling bearing has low precision and high friction loss. Small bore throttle hydrostatic gas bearings have low axial stiffness. Gas bearings are less rigid than oil and rolling bearings because of the compressibility of the gas. Compared with other throttling ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/00B24B41/04F16C32/06
Inventor 蒋书运徐春冬
Owner SOUTHEAST UNIV
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