Halogen resin composition and application thereof
A technology of resin composition and epoxy resin, applied in the field of resin composition, can solve the problems of affecting the stability of the resin composition, unable to achieve lead-free process, reducing the heat resistance of copper clad laminates, etc. Dielectric loss, the effect of overcoming poor heat resistance
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Embodiment 1
[0051] A halogen-containing resin composition prepared from the following raw materials in parts by weight:
[0052]
[0053] The halogen-containing resin composition of this example is selected to prepare a metal foil substrate, and the preparation method is as follows:
[0054] (1) dissolve.
[0055] Take the above-mentioned halogen-containing resin composition, use methyl ethyl ketone as a solvent, and stir at room temperature at high speed to obtain a resin glue solution with a solid content of 60 wt%.
[0056] (2) Impregnated and glued.
[0057] Take the glass fiber cloth of 2116 specifications and impregnate the above resin glue.
[0058] (3) drying.
[0059] Dry the glass fiber cloth impregnated with the resin glue solution at 160°C-190°C to obtain a prepreg.
[0060] (4) Take the prepreg prepared above and copper foil with a thickness of 1 ounce (35 μm thick), and press them with a hot press. The pressing specification is 2116×6ply. After 60 minutes, the metal ...
Embodiment 2
[0062] A halogen-containing resin composition prepared from the following raw materials in parts by weight:
[0063]
[0064] The metal foil substrate was prepared by using the halogen-containing resin composition of this example, and the metal foil substrate was prepared according to the preparation method in Example 1.
Embodiment 3
[0066] A halogen-containing resin composition prepared from the following raw materials in parts by weight:
[0067]
[0068] The metal foil substrate was prepared by using the halogen-containing resin composition of this example, and the metal foil substrate was prepared according to the preparation method in Example 1.
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