Method for synergistically regulating wettability by utilizing shape memory polymer and temperature response molecules

[0024] Specific implementation mode 1: A method for synergistically adjusting wettability by using shape memory polymers and temperature-responsive molecules, the results obtained are shown in the attached Figure 1-8 , the method includes the following steps:

[0025] Step 1: Etching the silicon wafer by photolithography, so that the surface of the silicon wafer presents different arrays. The length and width of the etched silicon wafer array are 10 μm×10 μm, the array spacing is 5 μm-30 μm, and the array height is 10 μm- 30μm;

[0026] Step 2: Use polydimethylsiloxane to shape the silicon wafer, the weight ratio of the prepolymer to the curing agent is 90-150:10, the curing temperature is 65-100°C, and the mold is demoulded after curing to obtain the silicon wafer. The opposite PDMS template of the sheet array;

[0027] Step 3: Use the PDMS template to shape the shape-memory epoxy resin microarray, use epoxy resin and curing agent, and mix the glue according to the weight ...

[0030] Specific embodiment 2: In the method of utilizing shape memory polymers and temperature-responsive molecules to coordinate wettability adjustment described in specific embodiment 1, in step 3, the epoxy resin is epoxy resin E51 or epoxy resin E44, so The curing agent is n-octylamine, dodecylamine, m-xylylenediamine, triethylenetetramine, and phthalimide.

[0031]Specific embodiment three: In the method for synergistically adjusting wettability by using shape memory polymers and temperature-responsive molecules described in specific embodiment one or two, in step four, the silane coupling agent is 3-aminopropylmethoxysilane Or 3 aminopropylethoxysilane.

[0032] The following table shows the xps analysis before the array is overwhelmed, overwhelmed and after recovery:

[0033]

[0034] It can be seen from the above table that the surface chemical substances do not change significantly during the shape change of the sample.