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A double-layer circuit and its manufacturing method

A manufacturing method and circuit technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problems of low production efficiency of liquid metal double-layer circuits, and achieve industrial manufacturing with high production efficiency and convenient batch production. The effect of simple production process

Active Publication Date: 2021-06-01
BEIJING DREAM INK TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, an object of the present invention is to propose a method for making a liquid metal double-layer circuit, to solve the problem of low production efficiency of the liquid metal double-layer circuit in the prior art

Method used

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  • A double-layer circuit and its manufacturing method
  • A double-layer circuit and its manufacturing method

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Embodiment approach 1

[0042] Step a, select PET film as the base material, the thickness of the base material is 200 μm;

[0043] Step b, drilling required via holes on the base material;

[0044] Step c, performing surface treatment on the base material, cleaning both sides of the base material and the inner wall of the via hole;

[0045] Step d, immersing the base material in the polyurethane colloid for 15 seconds, drying and curing after taking it out, forming a surface modification layer of 50 μm on the surface of the base material;

[0046] Step e, forming a solder resist layer on the surface modification layer on both sides of the base material by laser printing toner; wherein, the solder resist layer includes a silk screen layer of the circuit;

[0047] Step f, put the substrate into the liquid metal coating device and use the roller set to coat the liquid metal on both sides of the substrate; wherein, the liquid metal on the inner wall of the via hole is squeezed into the via hole by the ...

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Abstract

The invention provides a double-layer circuit and a manufacturing method thereof, and relates to the technical field of printed electronic manufacturing. Wherein, the manufacturing method includes: step S1, selecting a substrate; step S2, forming a via hole penetrating the substrate on the substrate; step S3, forming an adhesive on both sides of the substrate and the inner wall of the via hole. A surface modification layer with liquid metal attached; step S4, using a material that does not adhere to liquid metal to form a pattern that does not adhere to liquid metal on the surface modification layer on both sides of the substrate; step S5, on the surface modification Areas of the layer not covered by the non-adherent liquid metal pattern are coated with liquid metal to form a liquid metal double layer circuit. The liquid metal double-layer circuit in the embodiment of the present invention can realize the direct coating of the liquid metal on both sides of the substrate by using the coating of the adhesive and non-adherent liquid metal. Compared with the direct writing printing, the production efficiency is high and the production process Simple and convenient for batch industrial manufacturing.

Description

technical field [0001] The invention belongs to the technical field of printed electronics manufacturing, and in particular relates to a double-layer circuit and a manufacturing method thereof. Background technique [0002] With the continuous advancement of printed electronics technology, conductive fluids represented by liquid metals have made direct writing, printing and other circuit direct printing technologies possible. In the existing liquid metal direct writing and printing, the liquid metal ink infiltrates and adheres to the surface of the organic polymer substrate to realize the single-layer printing of the conductive circuit. [0003] However, for the production of double-layer circuits, the above-mentioned method needs to flip the single-layer liquid metal circuit, and then form a single-layer liquid metal circuit on the other side of the substrate, and then realize the double-layer circuit through drilling and via repairing processes. The production of the circ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/12H05K3/00H05K3/46H05K1/09
CPCH05K1/09H05K3/0091H05K3/1208H05K3/125H05K3/1275H05K3/46
Inventor 卢双豪于洋
Owner BEIJING DREAM INK TECH CO LTD
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