Circuit board manufacturing method for improving signal transmission precision

[0029] refer to figure 1 As shown, a method for manufacturing a multilayer circuit board for improving signal transmission accuracy, the method for manufacturing a multilayer circuit board includes the following steps:

[0030] S1. Slicing: Provide the substrate to be processed according to the production specifications, and the provided substrate has a metal layer on the front and back, and then open the substrate according to the production specifications;

[0031] S2. Lamination: Clean and dry the substrate after cutting. According to the number of layers of the circuit, stack the single-layer substrate according to the stacking sequence, and press the laminated multi-layer substrate. to obtain a multi-layer substrate;

[0032] S3. Pretreatment: the multi-layer substrate is opened, and the inside of the hole is copper-plated, and then the circuit pattern is transferred to the substrate, and it is exposed to plate making and development;

[0033] S4. Etching: Etch the subs...

[0036] A method for manufacturing a multilayer circuit board for improving signal transmission accuracy, the method for manufacturing the multilayer circuit board comprises the following steps:

[0037] S1. Slicing: Provide the substrate to be processed according to the production specifications, and the provided substrate has a metal layer on the front and back. The metal layer is a copper layer with a thickness of 30-50 microns, and a conductive film is arranged between the metal layer and the substrate. , and then cut the substrate according to the production specifications;

[0038] S2. Lamination: Clean and dry the substrate after cutting. According to the requirements of the number of layers of the circuit, stacking is performed on the single-layer substrate according to the stacking sequence, and PP is arranged between the stacked single-layer substrates. Sheet, the substrate and the PP sheet are stacked in order to form a pre-fixed circuit, the laminated multilayer sub...

[0043] refer to figure 2 As shown, a method for manufacturing a single-layer circuit board for improving signal transmission accuracy, the method for manufacturing a single-layer circuit board includes the following steps:

[0044] S1. Slicing: Provide the substrate to be processed according to the production specifications, and the provided substrate has a metal layer on the front and back, and then open the substrate according to the production specifications;

[0045] S2, pretreatment: the multi-layer substrate is opened, and the inside of the hole is copper-plated, and then the circuit pattern is transferred to the substrate, and it is exposed to plate making and development;

[0046] S3. Etching: The substrate is etched based on the circuit pattern to form a circuit, and the circuit is flattened;

[0047] S4. Installation: Based on the substrate, the components are welded and installed, and the installation is tested.