Integrated circuit product yield optimization using the results of performance path testing

[0020]As mentioned above, currently, performance measurements and, particularly, frequency measurements acquired during performance screen ring oscillator (PSRO) testing are often used to disposition (i.e., screen) chips at both the wafer-level and the module-level (i.e., the integrated circuit chip package-level). For purposes of this disclosure, wafer-level chip dispositioning refers to wafer-level performance testing to determine whether the chips on wafers pass and, thus, are processed into chip modules or fail and, thus, are scrapped. Similarly, module-level chip dispositioning refers to module-level performance testing to determine whether the chip modules pass and, thus, are shipped to customers or fail and, thus, are scrapped. Performance measurements acquired during post-manufacture (i.e., wafer-level or module-level) PSRO testing are also often used as feedback to control or re-center (i.e., re-calibrate) the manufacturing line in order to account for product-to-product la...