Crack growth evaluation apparatus, crack growth evaluation method, and recording medium recording crack growth evaluation program
a growth evaluation and crack technology, applied in the direction of mechanical roughness/irregularity measurement, apparatus for force/torque/work measurement, mechanical roughness/work measurement, etc., can solve the problem of requiring a long time, requiring several hours to several days to complete a one-cycle process, and difficulty in assuming the stress state of a crack when it develops in the soldered portion. to achieve the effect of accurately evaluating the growth of a crack
Active Publication Date: 2012-05-29
FUJITSU LTD
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Benefits of technology
Enables high-accuracy evaluation of crack growth in continua, significantly reducing computational time and aligning simulation results with actual measurements, allowing for precise prediction of crack growth and improved design of durable connections.
Problems solved by technology
However, in the conventional technique, since an initial shape (produced shape) is used as the shape of an analysis model of a soldered portion, it is difficult to assume the state of a stress when a crack develops in the soldered portion.
However, a current computer requires several hours to several days to complete a one cycle process.
Therefore, it requires quite a long time and is not practical for a computer to iteratively execute several hundreds cycles.
Accordingly, with the conventional technique, it is practically difficult to estimate a complete fracture life until the final fracture after the growth of a crack in the soldered portion and to estimate the growth process of a crack.
In addition, if a simulation result is different from an actual measurement result when a growth process of a crack occurring in a continuum such as a soldered portion and so on is simulated in the conventional technique, the simulation result is not corrected based on the actual measurement result.
Furthermore, in the conventional technique, when a growth rate of a crack occurring in a continuum is obtained based on a simulation result of a growth process of a crack occurring in the continuum, the growth rate of a crack cannot be automatically obtained.
Accordingly, the growth of a crack occurring in a continuum cannot be accurately evaluated in the conventional technique.
Method used
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Embodiment Construction
[0045]FIG. 1 is a diagram showing an example of a structure of a crack growth evaluation apparatus of the present embodiment.
[0046]A crack growth evaluation apparatus 1 is a computer that evaluates a growth of a crack occurring in a continuum. The crack growth evaluation apparatus 1 includes an analysis model generation unit 11, a stress / distortion analysis unit 12, an element damage determination unit 13, a change unit 14, a crack growth rate calculation unit (hereinafter referred to as a calculation unit) 15, an actual measurement value input unit 16, a Manson-Coffin law change unit 17, a display unit 18, a crack path node directive information storage unit 19, a coordinate point directive information storage unit 20, and a determination result information storage unit 21. Each unit provided for the crack growth evaluation apparatus 1 is realized by a CPU and a program present in main memory and executed on the CPU.
[0047]The analysis model generation unit (hereinafter referred to ...
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An element damage determination unit calculates a cumulative value of a damage value using a Manson-Coffin law for a plurality of finite elements of a continuum based on a result of a stress / distortion analyzing process, and determines whether or not the cumulative value of the damage value is equal to or exceeds a threshold. A calculation unit obtains first correspondence information indicating the correspondence between the number of cycles of a load and a growth rate of a crack occurring in the continuum based on the determination result. A Manson-Coffin law change unit changes a Manson-Coffin law based on the first correspondence information and second correspondence information indicating the correspondence between an actual measurement value of the number of cycles of a load applied to the continuum and an actual measurement value of the growth rate of a crack occurring in the continuum at that time.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims the conventional priority based on Japanese Application No. 2008-012272, filed on Jan. 23, 2008, the disclosures of which are incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a crack growth evaluation apparatus, a crack growth evaluation method, and a recording medium recording a crack growth evaluation program. More specifically, the present invention relate to a crack growth evaluation apparatus, a crack growth evaluation method, and a recording medium recording a crack growth evaluation program capable of evaluating with high accuracy the growth of a crack occurring in a continuum in a finite element method.[0004]2. Description of the Related Art[0005]For a solder material and various types of joining resin material (adhesive), stable connection reliability of a junction is important. Practically, it is necessary for a connected por...
Claims
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IPC IPC(8): G01B5/28
CPCG01N3/32G01N2203/0016G01N2203/006G01N2203/0066G01N2203/0224
Inventor SAKAI, HIDEHISAMORIMUNE, KATSUFUMIMOTEGI, MASANORIIIKAWA, TSUTOMU
Owner FUJITSU LTD
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