1989results about How to "Firmly assembled" patented technology

The invention discloses a nut cap of a tubular anastomat, belonging to a medical appliance. A sinking cavity is arranged in the inner end of a cap body and is internally provided with a backstop which is a bulge extending radially from the peripheral wall of the sinking cavity or a bulge extending axially from the bottom surface of the sinking cavity. The nut cap of the tubular anastomat is difficult to fall off from the rear end of an adjusting handle of the tubular anastomat and can improve the use reliability of the tubular anastomat.

An electrode support structure has a slotted hub and an integral body with a mid-section and opposed pair of spline elements that extend from the mid-section. The mid-section is captured within the slot, securing the integral body to the hub with the opposed spline elements radiating free of the slot for carrying one or more electrodes.

A system and associated method for manipulating tissues and anatomical or other structures in medical applications for the purpose of treating diseases or disorders or other purposes. In one aspect, the system includes a delivery device configured to deploy and implant anchor devices for such purposes.

The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of pre-applying adhesive directly to a bumped side of an integrated circuit chip. The method also includes the steps of removing portions of the adhesive from the tips of the solder bumps to expose a contact surface, and pressing the bumped side of the integrated circuit chip, which has previously been coated with adhesive, against the circuit substrate such that the bumps provide an electrical connection between the integrated circuit chip and the circuit substrate. The adhesive is removed from the tips of the solder bumps using a solvent assisted wiping action. The pre-applied adhesive on the chip forms a bond between the integrated circuit chip and the circuit substrate.

A system and associated method for manipulating tissues and anatomical or other structures in medical applications for the purpose of treating diseases or disorders or other purposes. In one aspect, the system includes a delivery device configured to deploy and implant anchor devices for such purposes.

A golf club head includes a body having at least one compartment and at least one damping member removably mounted in the at least one compartment. The damping member includes a receptacle, and a damping block is mounted in the receptacle for absorbing vibrations during a swing. The damping member includes an outer threading, and an inner periphery delimiting the compartment includes an inner threading for threadedly engaging with the outer threading of the damping member, allowing easy mounting and removal of the damping member.

A magnetron including a target (2) for sputtering onto a substrate in described. The magnetron comprises a magnetic field generator (4) for generating a closed loop magnetic field adapted to generate a plasma race-track above the target (2) and a driving device for establishing relative substantially translational movement between the race-track and the target (2) and adapted to influence the magnetic field generated by the magnetic field generator (4) at least during part of the relative substantially translational movement, the distance between any point on the race track and the momentarily closest part of the one or more pieces (50) of ferromagnetic material varying in accordance with the relative substantially translational movement of the race-track and the target (2).

The invention discloses a robot reducer transmission performance comprehensive testing device. The robot reducer transmission performance comprehensive testing device comprises a base (14), wherein a drive motor (1), a first coupling (2), a reducer input end torque angular displacement sensor (3), a second coupling (4), a to-be-tested reducer (5), a third coupling (6), a reducer output end torque angular displacement sensor (7), a fourth coupling (8) and a brake (9) are arranged on the base (14), share the same axis on the level direction, and are connected in sequence, and the drive motor (1), the reducer input end torque angular displacement sensor (3), the to-be-tested reducer (5) and the reducer output end torque angular displacement sensor (7) are respectively arranged on the base (14) through a motor support (10), a first support (11), a to-be-tested reducer support (12) and a second support (13). The robot reducer transmission performance comprehensive testing device meets the requirements of transmission performance tests such as high precision composite roller movable teeth transmission reducer ratio, return difference and efficiency, and thus testing efficiency and testing accuracy are high.

A method for preparing a bonding pad on an integrated circuit wafer by the steps of depositing a conductive seed layer (104) on the bonding pad; depositing a metal layer (301, 302, and 303) over a portion of the conductive seed layer; and immersing the wafer in an etchant solution (501) to remove the portion of the seed layer not covered by the metal layer. The etchant solution contains a chelating agent that bonds ions from the seed layer. When the seed layer is copper or a refractory metal, and the metal layer is gold or palladium, the preferred chelating agent is selected from, but is not limited to, but is not limited to, the families of ethylenediaminetetraacetic acids (EDTA), 8-hydroxy-quinolines, including 8-hydroxy-quinoline-5-sulfonic acid, porphyrins, and phthalocyanines.

A method and apparatus is provided for forming an electronic assembly whereby an insulating polymer matrix having a plurality of conductor holes is attached to a first substrate wherein the conductor holes align with a corresponding contact array on the first substrate. Subsequently, a flexible, electrically conductive adhesive is provided within the plurality of conductor holes and a solid conductive material, preferably having a high melting temperature, is attached to at least one end thereof. The insulating polymer matrix with the electrically conductive adhesive and the solid conductive material is then cured at a temperature sufficient to completely cure the matrix to completely surround the electrically conductive adhesive, as well as permanently attaching the matrix and conductive adhesive to the first substrate and permanently attaching the solid conductive material to the conductive adhesive. A second substrate may then be attached to the conductive matrix structure secured to the first substrate by providing a low melting temperature attachment means to the solid conductive material attached to the matrix and subsequently reflowing the assembly to form an electronic assembly adapted with the capability of reworkability.

The invention discloses an electric vehicle charging dock, comprising a flange plate (3), a charging dock main body (14) and a charging dock main body rear cover (15). The electric vehicle charging dock is mainly characterized by also comprising an LED (light emitting diode) indicator lamp component (DZ) used for monitoring the charging working condition. The electric vehicle charging dock has the characteristics that the structure is reasonable and compact, the operation is convenient, and the charging is safe and reliable.

An antenna includes antenna elements, an antenna feed assembly and at least one integrated circuit adjacent the antenna feed assembly on a side thereof opposite the antenna elements. The at least one integrated circuit is connected to the antenna elements via the antenna feed assembly. The antenna feed assembly includes a conductive base plate spaced from the antenna elements, and has feed openings therein. Spaced apart conductive posts are integrally formed with the conductive base plate as a monolithic unit, and extend outwardly therefrom toward the antenna elements. Each conductive post has at least one passageway therethrough aligned with at least one respective feed opening to define at least one antenna feed passageway. A respective elongated feed conductor extends through each antenna feed passageway.

An ultrasonic endoscope comprises an insertion portion including: an angle portion; a hard distal portion; an endoscopic observation unit comprising a lighting portion and an observation portion; and an ultrasonic test unit comprising an ultrasonic transducer constituting an ultrasonic test unit, wherein the hard distal portion includes: a distal end main body including an entire portion whereat the ultrasonic transducer is attached; an observation portion block that includes a portion whereat the observation portion is attached and that is separably coupled with the distal end main body; and an elevator block that is securely held between the distal end main body and the observation portion block by engaging the distal end main body and the observation portion block, and that comprises the elevator, and wherein the distal end main body, the observation portion block and the elevator block are assembled so as to be capable of being disassembled.

A shifter assembly includes an electronic shifter mechanism having a shift lever movable between a plurality of gear positions and an electrically powered drive system operatively connected to the shifter mechanism to selectively move the shifter mechanism between a first location wherein the shifter lever is located substantially within a housing and a second location wherein the shifter lever is located substantially outside the housing. The drive system moves the shifter mechanism along a vertical, linear path substantially parallel to a longitudinal axis of the shift lever such that the shift lever moves through an opening in the housing.

The invention discloses a co-location device for automatically butting and assembling large-sized thin-wall barrel-shaped members and belongs to the field of assembling butting technologies. The co-location device comprises at least two sets of location mechanisms fixedly connected with the large-sized thin-wall barrel-shaped members to be assembled respectively, wherein each location mechanism comprises a slide chassis, a transverse posture adjustment platform, a vertical posture adjustment platform and a rotary posture adjustment platform. The device has the advantages of high operation precision, high automation level, large bearing capacity, high response speed and wide motion range, and can be used for accurately butting and assembling the large-sized thin-wall barrel-shaped members.

A method and apparatus is provided for forming an electronic assembly whereby an insulating polymer matrix having a plurality of conductor holes is attached to a first substrate wherein the conductor holes align with a corresponding contact array on the first substrate. Subsequently, a flexible, electrically conductive adhesive is provided within the plurality of conductor holes and a solid conductive material, preferably having a high melting temperature, is attached to at least one end thereof. The insulating polymer matrix with the electrically conductive adhesive and the solid conductive material is then cured at a temperature sufficient to completely cure the matrix to completely surround the electrically conductive adhesive, as well as permanently attaching the matrix and conductive adhesive to the first substrate and permanently attaching the solid conductive material to the conductive adhesive. A second substrate may then be attached to the conductive matrix structure secured to the first substrate by providing a low melting temperature attachment means to the solid conductive material attached to the matrix and subsequently reflowing the assembly to form an electronic assembly adapted with the capability of reworkability.

A heat-dissipating device for a back light source for a flat panel display includes at least one back light unit, a circuit board, and at least one heat-dissipating board. The back light unit includes a lighting element and a thermally conductive portion connected thereto for absorbing heat generated by the lighting element. The circuit board includes at least one assembling hole and is electrically connected to the back light unit to form a back light module. The heat-dissipating board is mounted to a rear side of the heat-dissipating board. The thermally conductive portion of the back light unit is extended through the assembling hole of the circuit and directly in contact with the rear side of the heat-dissipating board, allowing the heat-dissipating board to absorb and thus dissipate the heat generated by the back light module.

A method for preparing a bonding pad on an integrated circuit wafer by the steps of depositing a conductive seed layer (104) on the bonding pad; depositing a metal layer (301, 302, and 303) over a portion of the conductive seed layer; and immersing the wafer in an etchant solution (501) to remove the portion of the seed layer not covered by the metal layer. The etchant solution contains a chelating agent that bonds ions from the seed layer. When the seed layer is copper or a refractory metal, and the metal layer is gold or palladium, the preferred chelating agent is selected from, but is not limited to, but is not limited to, the families of ethylenediaminetetraacetic acids (EDTA), 8-hydroxy-quinolines, including 8-hydroxy-quinoline-5-sulfonic acid, porphyrins, and phthalocyanines.

The invention relates to a press-mounting machine for compressing a press ring and assembling the press ring on a corresponding workpiece. The press-mounting machine comprises a base, a support frame with a top plate and a press-mounting device, wherein the support frame with the top plate is arranged on the base; the press-mounting device is arranged on the base and positioned below the top plate and comprises a hydraulic jacking device and a press-mounting tooling, wherein the press-mounting tooling is arranged at the top of the hydraulic jacking device and comprises a base plate and a plurality of convex columns arranged on the base plate; and the top ends of the convex columns are provided with lug bosses matched with pressing rings of the press-mounting tooling. The press-mounting machine has simple structure, low cost, good press-mounting effect, steady assembly and high production efficiency and is very convenient, used for pressing and mounting a metal ring to a part matched with the metal ring and especially suitable for pressing and mounting a conductive pressing ring to the bottom of an inner cavity of the head part of a electric torch.

The invention provides a folding light path laser cooling atom device which is mainly composed of a vacuum tetrakaidecahedron, cooling light source assemblies, reflecting mirror assemblies, transfer mirror assemblies and anti-helmholtz magnetic field coils. The folding light path laser cooling atom device integrates a laser beam expansion collimation system, a folding light path, a polarization transformation system, the anti-helmholtz magnetic field coils and optical power real-time monitoring, six paths of laser required by a traditional laser cooling magneto optical trap is reduced to two paths of laser, the size and weight of an optical-mechanical system are reduced to the maximum degree, a space topology structure is simplified, and the optical-mechanical system is extremely good in mechanical property and thermal environment adaptability and can be applied to the severe environment of the space level. According to the folding light path laser cooling atom device, samples have passed ring die tests, such as a space level mechanical vibration test, a mechanical impact test, a thermal cycle test and a thermal vacuum test, long-term stable working can be kept, and the device can serve as a core optical-mechanical device of the laser cold atom application engineering.

An assembly method in which a brazing metal is initially filled into radial wells pierced in an annular injection piece having first injection orifices for discharging a primary fuel, and in a cylindrical endpiece surrounding the annular injection piece and having secondary injection orifices for discharging a secondary fuel; thereafter the annular injection piece is fitted inside the cylindrical endpiece and these pieces are together fitted on a first tube for feeding primary fuel and a second tube for feeding secondary fuel and surrounding the first tube, and also to an outer wall of the injector; finally, the end portion of the injector as assembled in this way is placed in an enclosure where it is heated so as to melt the brazing metal to unite the parts.

A knife includes a metal blade having an integral tang, the tang having a tang end and being a flat bar shaped to carry a handle, a plastic handle having an handle end defining a well surrounding the tang end, and a metal end cap comprising an integrally formed plug section. The metal end cap is attached at the handle end to positively fit the plug section in the well. The plug section has a plug end facing the tang end and defining a recess in which the plug section encloses the tang end in a positive fit. Also provided is a method for fixing the metal end cap in the plastic well at the handle end of the knife which comprises the step of exciting the metal end cap with ultrasonic energy while inserting the metal end cap into the well to thereby plasticate the plastic in the handle.

A tri-fold plastic egg carton for protecting jumbo eggs in both oriented and non-oriented positions. A cell base and cell cover are hingedly connected in a closed position with the cover over the base to form a complimentary 2×6 matrix of cell pockets for holding individual eggs. A lid is hingedly connected to another edge of the base for closing over the assembled cover and base. The non-hinged peripheral edges of the base, cover and lid form a trim perimeter having a turned up lip edge, the lip edges mating when the carton is in the closed position to increase the carton strength. The carton can accommodate a full range of jumbo eggs, and accept a variety of smaller size eggs, while fitting within standard cases and half-cases.

A connector assembly is provided. The connector assembly includes a housing having at least a socket, an electronic device disposed in the housing, a protection member disposed on a side of the housing, a light emitting element disposed on the protection member, a light pipe disposed on the housing for guiding light from the light emitting element, a shield surrounding the protection member and the light emitting element, and a cover encompassing the light pipe, the shield, and the light emitting element.

Mount for semiconductor laser devices comprises thermally conductive anode and cathode blocks on either side of semiconductor laser device such as laser diode. Interposed between at least the anode block and the anode of the semiconductor laser device is a sheet of conformable electrically conductive material with high thermal conductivity such as pyrolytic highly-oriented graphite. In some embodiments, a second sheet of such electrically and thermally conductive conformable material is interposed between the cathode of the semiconductor laser device and the cathode block. The semiconductor laser device can be either a single laser diode or a diode bar having a plurality of emitters. A thermally conductive, but electrically insulating, spacer of essentially the same thickness as the laser diode or bar surrounds the diode or bar to prevent mechanical damage while still permitting the conformable material to be maintained in a compressed state and directing current through the laser device.

A metal structure (600) for a bonding pad on integrated circuit wafers, which have interconnecting metallization (101) protected by an insulating layer (102) and selectively exposed by windows in the insulating layer. The structure comprises a patterned seed metal layer (104) positioned on the interconnecting metallization exposed by the window so that the seed metal establishes ohmic contact to the metallization as well as a practically impenetrable seal of the interface between the seed metal and the insulating layer. Further, a metal stud (301) is formed on the seed metal and aligned with the window. The metal stud is conformally covered by a barrier metal layer (501) and an outermost bondable metal layer (502).

An electric hair clipper for adjusting a cutter kit includes a combination housing having a first locating rib and a second locating rib. A motor is received inside the combination housing, the motor has a fixing means, a spindle is provided to rotate. A fixation mounter has a mounting seat fixed by the fixing means, a first locating slot and a second locating slot engaged with the first locating rib and second locating rib of the combination housing respectively. A driving roller set has an impelling roller eccentrically and rotatably connected to the spindle of the motor. A linking frame has two mounter fixing portions, a bridge connects the two mounter fixing portions. A swiveling leverage has a lever body, a driven portion and a blade driving portion connected to each end of the lever body. And a pivot set pivoted to the linking frame and the swiveling leverage.

A roller bearing cage is made of a resin and has a tapered tubular shape as a whole. In the roller bearing cage, tapered rollers are forcibly fitted to pockets while elastically deforming pillar portions at a small-diameter annular portion side. A stress alleviating portion is provided on at least an outer circumferential side of an end of the pillar portion at the small-diameter annular portion side so that a portion of the pillar portion from a crossing portion between the pillar portion and the small-diameter annular portion to a side of the large-diameter annular portion is linearly cut, thereby alleviating the stress occurring in the pillar portion when the tapered roller is forcibly fitted to the pocket.

The invention discloses a heat radiation structure of a circuit module and an outdoor unit of a variable-frequency air conditioner. The heat radiation structure comprises a circuit board (1), a mounting support (2), electronic devices (3) and a heat radiator (4), wherein the electronic devices penetrate one side of the mounting support to be connected with a circuit board on the other side, and the heat radiator is abutted against the surfaces of the electronic devices; a zigzag structure (21) used for reducing mutual contact area is formed on the contact surface between the circuit board and the mounting support. Furthermore, the heat radiation structure comprises an electric control box (5), various parts are sequentially stacked in the electric control box, the heat radiator extends out of the electric control box, and an air inlet passage (7) facing the heat radiator is formed on the electric control box. The heat radiation structure is mounted in a case (9) via the electric control box and close to an air wheel (12) of the outdoor unit. With the zigzag structure, water accumulation is well prevented; with the mounting structure and the air passage, heat radiation effect of the heat radiator is well improved so as to radiate heat on the surface of the circuit board.