488results about How to "Improve environmental resistance" patented technology

The current invention provides the promoter of the Zea mays nuclear gene encoding chloroplast-localized fructose-1,6-bisphosphate (F16BP) aldolase. Compositions comprising this sequence are described, as are plants transformed with such compositions. Further provided are methods for the expression of transgenes in plants comprising the use of these sequences. The methods of the invention include the direct creation of transgenic plants with the chloroplastic F16BP aldolase promoter by genetic transformation, as well as by plant breeding methods. The sequences of the invention represent a valuable new tool for the creation of transgenic plants, preferably having one or more added beneficial characteristics.

A semiconductor light-emitting device includes substrate (3), a plurality of light-emitting-element-layers (10a, 10b, 10c, . . . ) of semiconductor material formed on the substrate (3) so as to be isolated from each other and having a wider band gap than the substrate (3), and phosphors (15a, 15b, 15c, . . . ) converting wavelengths of light from the light-emitting-element-layers (10a, 10b, 10c, . . . ) into other wavelengths.

A novel method for production of and an apparatus for an encapsulated solid-state electrochemical device is disclosed. The present invention provides for electrical devices, such as, for example, thin-film batteries with sensitive chemistries that can survive environmental exposure while providing external electrical contact to the internal cell chemistry. The method of packaging of the present invention may include bonding one or more protective multi-layer laminates to the environmentally sensitive surfaces of an electronic device. The present invention may provide the advantage of avoiding entrapped air beneath the laminates.

A novel method for production of and an apparatus for an encapsulated solid-state electrochemical device is disclosed. The present invention provides for electrical devices, such as, for example, thin-film batteries with sensitive chemistries that can survive environmental exposure while providing external electrical contact to the internal cell chemistry. The method of packaging of the present invention may include bonding one or more protective multi-layer laminates to the environmentally sensitive surfaces of an electronic device. The present invention may provide the advantage of avoiding entrapped air beneath the laminates.

A method and apparatus for making thin-film batteries having composite multi-layered electrolytes with soft electrolyte between hard electrolyte covering the negative and / or positive electrode, and the resulting batteries. In some embodiments, foil-core cathode sheets each having a cathode material (e.g., LiCoO2) covered by a hard electrolyte on both sides, and foil-core anode sheets having an anode material (e.g., lithium metal) covered by a hard electrolyte on both sides, are laminated using a soft (e.g., polymer gel) electrolyte sandwiched between alternating cathode and anode sheets. A hard glass-like electrolyte layer obtains a smooth hard positive-electrode lithium-metal layer upon charging, but when very thin, have randomly spaced pinholes / defects. When the hard layers are formed on both the positive and negative electrodes, one electrode's dendrite-short-causing defects on are not aligned with the other electrode's defects. The soft electrolyte layer both conducts ions across the gap between hard electrolyte layers and fills pinholes.

A method for fracture stimulation of a subterranean formation includes providing a thermoset polymer nanocomposite particle precursor composition comprising a polymer precursor mixture, dispersed within a liquid medium, containing at least one of an initiator; at least one of a monomer, an oligomer or combinations thereof, said monomer and oligomer having three or more reactive functionalities capable of creating crosslinks between polymer chains; at least one of an impact modifier; and nanofiller particles substantially dispersed within the liquid medium; subjecting the nanocomposite particle precursor composition to suspension polymerizing conditions; subjecting the resulting nanocomposite particles to heat treatment; forming a slurry comprising a fluid and a proppant that includes the heat-treated nanocomposite particles; injecting the slurry into a wellbore; and emplacing the proppant within a fracture network in the formation.

A process for the manufacture of a composite article is described wherein the process comprises the steps of (i) providing on a tool (22) a fibrous material (14) having associated therewith in at least one region thereof an in-situ polymerisable non-fibrous form of a thermoplastic material; (ii) applying heat and a vacuum to said material; and additionally (iii) drawing into the fibrous material, from a source external to the tool, additional thermoplastic pre-polymer material. The process described is particularly useful for the manufacture of a large composite structure such as thermoplastic composite wind turbine blade, for example.

A sonic actuator including a multi-layer membrane having a non-metallic elastomeric dielectric polymer layer with a first surface and a second surface, a first compliant electrode layer contacting the first surface of the polymer layer, and a second compliant electrode layer contacting the second surface of the polymer layer. The actuator further includes a support structure in contact with the sonic actuator film. Preferably, the non-metallic dielectric polymer is selected from the group consisting essentially of silicone, fluorosilicone, fluoroelastomer, natural rubber, polybutadiene, nitrile rubber, isoprene, and ethylene propylene diene. Also preferably, the compliant electrode layer is made from the group consisting essentially of graphite, carbon, and conductive polymers. The support structure can take the form of grid having a number of circular apertures. When a voltage is applied to the electrodes, portions of the film held at the aperture of the support structure can bulge due to the electrostriction phenomenon. The resultant “bubbles” can be modulated to generate sonic vibrations, or can be used to create a variable surface for airflow control.

A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer and wherein the silicone layer is prepare by the method of the invention.

A vibration transducer (e.g. a condenser microphone) having a high sensitivity is constituted of a housing composed of an airtight material having a through-hole, a vibration conversion die (e.g. a microphone die) which is attached to the interior surface of the housing at the prescribed position embracing the through-hole in plan view, and a barrier diaphragm composed of an airtight material whose external periphery is attached to the exterior surface of the housing in an airtight manner oppositely to the prescribed position. The barrier diaphragm has a vibration area which is larger than the sectional area of the through-hole. A space allowing the barrier diaphragm to vibrate is formed between the barrier diaphragm and the exterior surface of the housing, wherein the distance between the barrier diaphragm and the exterior surface of the housing can be gradually reduced from the vibration axis to the external periphery.

An MgF2 optical thin film is formed on an optical surface of a base material. The MgF2 optical thin film includes MgF2 particles and an amorphous silicon oxide-based binder which exists on the surfaces of the MgF2 particles and between the MgF2 particles. Owing to this amorphous silicon oxide-based binder, the optical thin film can have high mechanical strength and high adhesion to the base material, while having excellent environment resistance and a lower refractive index.

An imaging lens includes, in order from an object side, a positive first lens group, a stop, and a positive second lens group. The first lens group includes, in order from the object side, a first lens, which is a negative meniscus lens having a convex object-side surface, and a second lens having a positive power and including a convex image-side surface. The second lens group includes, in order from the object side, a third lens having a negative power and including a concave object-side surface, a fourth lens having a positive power and including a convex image-side surface, a fifth lens, which is a biconvex lens, and a sixth lens, which is a meniscus lens having a negative power and including a convex surface facing an image side. Each of the first to sixth lenses is a single spherical glass lens.

An imaging lens is provided and includes, in order from the object side, a front group having a negative power, a stop, and a rear group having a positive power. The front group includes, in order from the object side, a first negative lens having a meniscus shape with a concave surface on an image side, a second negative lens, and a third positive lens. The rear group includes, in order from the object side, a fourth positive lens, a fifth negative lens having a meniscus shape with a concave surface on the object side, and a sixth positive lens. An Abbe number of each of the first lens, the second lens, the fourth lens, and the sixth lens at the d-line is equal to or larger than 40, and an Abbe number of each of the third lens and the fifth lens at the d-line is equal to or smaller than 40. Each lens constituting the front group and the rear group is a single lens.

Disclosed herein is a light emitting diode includes: a first semiconductor layer of a first conductivity type; an active layer on the first semiconductor layer; a second semiconductor layer of a second conductivity type on the active layer; a first electrode configured to be electrically coupled to the first semiconductor layer; and a second electrode configured to be provided on the second semiconductor layer and be electrically coupled to the second semiconductor layer, the second electrode including a first metal film that has a predetermined shape and is composed mainly of silver and a second metal film that covers the first metal film and is composed mainly of palladium and / or platinum.

A sealing structure includes a lead frame having a light transmitting section, an optical element having an optical surface which is directed to the light transmitting section and is mounted on the lead frame in such a state that the optical element blocks the light transmitting section at its one end portion in an axis direction, and a sealing body that is formed in a region excluding an optical path and seals the optical element. By forming the sealing body in the region excluding the optical path, the light usage efficiency can be prevented from decreasing even when a material that can increase the environmental resistance is added to the sealing body. Further, since the optical element is mounted on the lead frame with its face down, the sealing structure can be easily formed even when the optical element is small-sized.

An environmental coating suitable for use on turbine components, such as turbine disks and turbine seal elements, formed of alloys susceptible to oxidation and hot corrosion. The environmental coating is predominantly a solid solution phase of nickel, iron, and / or cobalt. The coating contains about 18 weight percent to about 60 weight percent chromium, which ensures the formation of a protective chromia (Cr2O3) scale while also exhibiting high ductility. The coating may further contain up to about 8 weight percent aluminum, as well as other optional additives. The environmental coating is preferably sufficiently thin and ductile to enable compressive stresses to be induced in the underlying substrate through shot peening without cracking the coating.

A method for fracture stimulation of a subterranean formation includes providing a thermoset polymer nanocomposite particle precursor composition comprising a polymer precursor mixture, dispersed within a liquid medium, containing at least one of an initiator; at least one of a monomer, an oligomer or combinations thereof, said monomer and oligomer having three or more reactive functionalities capable of creating crosslinks between polymer chains; at least one of an impact modifier; and nanofiller particles substantially dispersed within the liquid medium; subjecting the nanocomposite particle precursor composition to suspension polymerizing conditions; subjecting the resulting nanocomposite particles to heat treatment; forming a slurry comprising a fluid and a proppant that includes the heat-treated nanocomposite particles; injecting the slurry into a wellbore; and emplacing the proppant within a fracture network in the formation.

The present invention provides an oxynitride phosphor represented by a composition formula M(1)1−jM(2)jSibAlcOdNe (composition formula I) or a composition formula M(1)1−a−jM(2)jCeaSibAlcOdNe (composition formula II) and containing 50% or more of a JEM phase, and a light emitting device including a semiconductor light emitting element emitting an excited light, a first phosphor that is the oxynitride phosphor according to the present invention that absorbs the excited light and emits a fluorescence, and a kind or a plurality of kinds of second phosphor(s) that absorb(s) the excited light and emit(s) a fluorescence having a longer wavelength than the fluorescence emitted by the first phosphor. Thereby, a novel oxynitride phosphor being capable of highly efficiently emitting mainly a light having a wavelength of 510 nm or less and a light emitting device using the same can be provided.

On one surface of a lead frame 4 having an aperture 7 passing through in thickness direction thereof, a submount having transparency for closing the aperture 7 of the lead frame 4 is disposed. On a surface of the submount opposite to a surface of the submount 8 facing the aperture 7 of the lead frame 4, a semiconductor optical device 3 is disposed in such a way that an optical portion thereof faces toward the aperture. The semiconductor optical device 3 is electrically connected to the lead frame 4 via wire 5. At least one surface of the lead frame 4, the semiconductor optical device 3 and the submount 8 are encapsulated with a molding portion 10 made of a non-transparent molding resin in a state that the aperture 7 on the other surface side of the lead frame 4 is exposed.

In an optical system, there is disposed a solid material having refractive surfaces on both of the light incidence side and a light emergence side, and the Abbe number vd and the partial dispersion ratio θgF satisfy the conditions:−2.100×10−3·vd+0.693<θgF; and0.555<θgF<0.6.

A semiconductor package comprising a semiconductor wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and at least one cured silicone member covering at least a portion of the active surface, wherein at least a portion of each bond pad is not covered by the silicone member, the silicone member has a coefficient of linear thermal expansion of from 60 to 280 μm / m° C. between −40 and 150° C. and a modulus of from 1 to 300 MPa at 25° C., and the silicone member is prepared by the method of the invention.

The present invention provides a toner which is obtained by dissolving and / or dispersing in an organic solvent a toner material that includes at least a functional group-containing modified polyester resin capable of undergoing an elongation reaction and / or a crosslinking reaction with an active hydrogen group-containing compound, a vinyl resin, a releasing agent, and a colorant to prepare a toner solution, then emulsifying and / or dispersing the toner solution in an aqueous medium to prepare an emulsified dispersion, and allowing the functional group-containing modified polyester resin to undergo an elongation reaction and / or a crosslinking reaction with the active hydrogen group-containing compound in the aqueous medium, wherein the vinyl resin is concentrated near the surface of the toner.

An Ag alloy reflective layer for optical information recording medium having excellent environmental resistance, an optical information recording medium having such Ag alloy reflective layer, and the like are provided. This Ag alloy reflective layer for an optical information includes 0.1 to 5 atomic % in total of at least one element selected from W, Ti, V, Mn, Zr, Cr, and Ni; 0.005 to 1 atomic % of Bi; and the residue of Ag and inevitable impurities. As a consequence, this Ag alloy reflective layer has improved environmental resistance including the light resistance for the light beam of particular wavelength and resistance to moist heat under particular set of conditions.

The present invention relates to one kind of nano conducting silver paste and its preparation, and aims at solving the problems of conducting paste with higher conducting stuffing content, high colloid viscosity and unsuitability in connecting through holes in multi-layer circuit board. According to the self-assembling and low temperature welding features of the nano silver particles, the presentinvention prepares nano silver powder via microemulsion process and low-content conducting nano silver particle paste with epoxy resin stuffing component. The paste has high conductivity, low colloidviscosity and thus wide application foreground in fixing electronic elements onto circuit board, connecting electrodes and especially connecting through holes in multi-layer circuit board.

An imaging lens consists of negative first lens having a concave image-side surface, positive second lens, negative third lens, positive fourth lens, positive fifth lens having a convex image-side surface, and negative sixth lens, which are in this order from an object side. In the imaging lens, all of the lenses constituting the lens system are single lenses, which are not cemented lenses, and a stop is arranged closer to the object side than an image-side surface of the fourth lens is arranged. When a refractive index of a material of the third lens for d-line is Nd3, the following formula (1-1) is satisfied:Nd3<1.65  (1-1).

An alternator (AC generator) to be mounted on a vehicle comprises slip rings, brushes, a brush holder, a rear cover, and sealing members. The slip rings are fixed on a rotary shaft and rotatable together with the rotary shaft. The brushes are slidable on the slip rings and the brush holder accommodates the brushes therein. The slip-ring cover covers the slip rings as well as the brush holder and the rear cover covers electronic components including the brushes. The sealing members give a sealing performance to an inner space containing slid portions of the brushes on the slip rings. The rear cover, the brush holder, and the sealing member have a ventilating passage for positively causing an flow of air from the inner space containing the slid portions of the brushes on the slip rings to an outside of the alternator.

In an optical element, a first mirror stack layer is formed on a substrate, and a spacer layer made of a paraelectric material having a secondary electrooptic effect is formed thereon through a first conductive thin film. Further, a second mirror stack layer is formed thereon through a second conductive thin film, and a coupling layer is formed thereon; thus, a basic structure of the optical element is formed. By changing a voltage to be applied between the first and second conductive thin films, it becomes possible to switch wavelengths of light to be transmitted through the optical element at a high speed.

An optical semiconductor device 1a includes a lead frame 4 having an aperture 7, a submount 8 disposed on one surface of the lead frame 4 to close the aperture 7, a semiconductor optical element 3 which has an optical portion 6 and which is mounted on a surface of the submount 8 opposite to a surface on a side of the aperture 7 with the optical portion 6 facing the aperture 7 through the submount 8, a molding portion 10 made of a non-transparent molding resin which exposes at least a region including the aperture 7 on the other surface side of the lead frame 4 and which encapsulates the lead frame 4, the semiconductor optical element 3 and the submount 8, and a lens 9 disposed on the other surface of the lead frame 4 to close the aperture 7.

An imaging lens is provided and includes, in order from the object side, a front group having a negative power, a stop, and a rear group having a positive power. The front group includes, in order from the object side, a first negative lens having a meniscus shape with a concave surface on an image side, a second negative lens, and a third positive lens. The rear group includes, in order from the object side, a fourth positive lens, a fifth negative lens having a meniscus shape with a concave surface on the object side, and a sixth positive lens. An Abbe number of each of the first lens, the second lens, the fourth lens, and the sixth lens at the d-line is equal to or larger than 40, and an Abbe number of each of the third lens and the fifth lens at the d-line is equal to or smaller than 40. Each lens constituting the front group and the rear group is a single lens.

The present invention provides a method for producing a homogeneous complex oxide sol comprising Si and a metal other than Si as metal elements, and a method for producing a Si-containing hologram recording material using a homogeneous complex oxide sol. A method for producing a complex oxide sol comprising Si and a metal other than Si as metal elements, the method comprising: mixing a silanol compound with an alkoxide compound of a metal other than Si so that the silanol compound is reacted with the alkoxide compound, thereby yielding a precursor of a complex oxide, and adding water to the complex oxide precursor so as to hydrolyze an alkoxyl group bonded to the metal other than Si, and then making the resulting hydrolysate undergo a condensation reaction, thereby forming a complex oxide. A hologram recording medium (11) having a hologram recording layer (21) comprising the hologram recording material obtained by the production method.