691results about How to "Improve heat dissipation" patented technology

A retrofit light emitting diode (LED) lighting luminaire designed to have detachable and replaceable components for convenience and low cost in the luminaire maintenance including a heat dissipation member that includes detachable upper and lower sections with aligned radially extending fins, and a driver retained within the luminaire. The LED chip is retained against a surface of the lower heat dissipation member so that heat from the LED is transmitted to the radially extending fins to thereby effectively cool the LED lighting source and driver.

On implementation of the invention provides a stackable chip-scale package for improving memory density that may be mounted within a limited area or module. A novel staggered routing scheme enables the use of the same trace routing at every level of the stacked architecture for efficiently accessing individual memory devices in a chip-scale package stack. The use of a ball grid array chip-scale package architecture in combination with thermally compatible materials decreases the risk of thermal cracking while improving heat dissipation. Moreover, this architecture permits mounting support components, such as capacitors and resistors, on the chip-scale package.

A solid-state lighting device (500) includes a plurality of light-emitting elements (510, 525, 530) configured for generating light that are thermally coupled to a heat spreading chassis configured for coupling to one or more heat sinks (520). The lighting device further includes a mixing chamber which is optically coupled to the plurality of light-emitting elements and configured to mix the light emitted by the plurality of light-emitting elements. A control system is operatively coupled to the plurality of light-emitting elements, and configured to control operation of the plurality of light-emitting elements.

A light-emitting diode (LED) automobile headlamp comprises an LED lamp, a heat conduction component and a heat dissipation component, wherein the LED lamp is arranged on a substrate; the heat conduction component is in a long strip shape, the substrate is fixed at one end of the heat conduction component, and the heat conduction component is filled with low-boiling-point liquid; the heat dissipation component comprises a heat dissipation barrel and cooling fins, the heat dissipation barrel is provided with a through hole for accommodating the heat conduction component, and the cooling fins are fixedly arranged around one end of the heat dissipation barrel away from the substrate. According to the LED automobile headlamp, traditional tungsten filaments and high intensity discharge (HID) are replaced with the LED lamp, the low-boiling-point liquid in the heat conduction component is utilized to transmit heat generated by the LED lamp to the rear end in a circulated mode, and the heat dissipation component is utilized to dissipate the heat.

A package structure of a compound semiconductor device comprises a thin film substrate, a die, at least one metal wire and a transparent encapsulation material. The thin film substrate comprises a first conductive film, a second conductive film, and an insulating dielectric material. The die is mounted on the surface of the first conductive film, and is electrically connected to the first conductive film and the second conductive film through the metal wire. The transparent encapsulation material overlays the first conductive film, second conductive film, and die. The surfaces of the first conductive film and second conductive film which is opposite the transparent encapsulation material act as electrodes. The insulating dielectric material is between the first conductive film and second conductive film.

A semiconductor package device, a semiconductor package structure, and fabrication methods thereof are provided, which mainly includes disposing a plurality of semiconductor chips on a wafer formed with TSVs (Through Silicon Vias) and electrically connecting the semiconductor chips to the TSVs; encapsulating the semiconductor chips with an encapsulant; and disposing a hard component on the encapsulant. The hard component ensures flatness of the wafer during a solder bump process and provides support to the wafer during a singulation process such that the wafer can firmly lie on a singulation carrier, thereby overcoming the drawbacks of the prior art, namely difficulty in mounting of solder bumps, and difficulty in cutting of the wafer.

A photoactivation apparatus (200) separately delivers light to a plurality of wells of a multiwell plate (110). The device-includes a plurality of light emitting diodes (210) attached to a first surface of a substrate (220) such that when the photoactivation apparatus is positioned on the multiwell plate each of the light emitting diodes delivers light to one corresponding well. The light emitting diodes (210) may extend at least partially into the wells of the multiwell plate. A heat sink (250) and fan may be provided on the device to dissipate heat generated by the light emitting diodes. The components are preferably enclosed in a conveniently-sized housing (270). The housing may include one or more grips and air vents. The apparatus includes an interlocking lip (230) defining a recess which is sized to receive at least a portion of the multiwell plate. A power supply connected to the apparatus and configured to provide an equal voltage across each of the light emitting diodes.

Heat dissipation, is improved, of a semiconductor device on a tape carrier package, in which the number of outputs of the semiconductor device has been increased for implementing a multi-channel configuration and narrower pitches are employed. There are included a tape carrier 20 having lead patterns 21 to 24 formed on a tape base 28 thereof, and a semiconductor device 10 mounted on the tape carrier 20 and having electrode patterns 11 to 14 disposed thereon. The semiconductor device 10 includes heat dissipating electrode patterns 15 to 17 at positions where the heat dissipating electrode patterns 15 to 17 do not interfere with the electrode patterns 11 to 14. The lead patterns 21 to 24 are electrically connected to the corresponding electrode patterns 11 to 14, respectively. On the tape carrier 20, heat dissipation patterns are formed. The heat dissipation patterns are disposed at positions where the heat dissipation patterns do not interfere with the lead patterns 21 to 24 and are also electrically and thermally connected to the corresponding heat dissipating electrode patterns 15 to 17, respectively.

The invention relates to a lighting device (1) comprising a housing (8) with a light source connector for a LED (11) and a reflective collimator (3) and a refractive collimator (9) as well as to a method for their manufacture. The reflective collimator (3) comprises a plurality of reflective segments (4, 4′, 5, 5′, 6, 6′, 7, 7′), which are spaced apart from each other by means of air slits suitable for dissipation of heated air. The segments (4, 4′, 5, 5′, 6, 6′, 7, 7′) are adapted to reflect laterally emitted light generated by the light source (11) towards a direction which is substantially parallel to said main direction. Lighting devices according to this invention may have a compact design and an improved dissipation of the heat generated by the LEDs.

The invention discloses a heat dissipation power distribution cabinet comprising a cabinet body of heat dissipation power distribution cabinet, wherein an air inlet of heat dissipation power distribution cabinet is formed in the top of the cabinet body of heat dissipation power distribution cabinet, an air inlet cover is arranged at the air inlet, heat dissipation windows of heat dissipation powerdistribution cabinet are arranged on two side walls of the cabinet body of heat dissipation power distribution cabinet, heat dissipation window covers are arranged at the heat dissipation windows, afan of heat dissipation power distribution cabinet is arranged at the heat dissipation window of heat dissipation power distribution cabinet on one side, the fan of heat dissipation power distributioncabinet is located in the cabinet body of heat dissipation power distribution cabinet, an air outlet of heat dissipation power distribution cabinet is formed in the bottom of the cabinet body of heatdissipation power distribution cabinet, a metal screen of heat dissipation power distribution cabinet is arranged at the air outlet of heat dissipation power distribution cabinet, and a cabinet doorheat dissipation power distribution cabinet is arranged on the cabinet body of heat dissipation power distribution cabinet. The heat dissipation power distribution cabinet disclosed by the invention can solve the problem that the service lives of circuit components in the power distribution cabinet are shortened due to poor heat dissipation.

The invention belongs to the technical field of solar cells and particularly relates to a high-radiation solar cell backboard. The high-radiation solar cell backboard is characterized by comprising an anti-scraping wear-resistant coating, a first adhesive layer, an aluminum alloy layer, a second adhesive layer, an insulation isolation layer, a third adhesive layer and an ethylene-vinyl acetate bonding layer which are connected in sequence. The high-radiation solar cell backboard has the advantages that aluminum alloy is good heat conductor, and heat generated in a cell component can be dissipated timely so as to guarantee the service life of a solar cell; the compact structure of the aluminum coil is good in moisture blocking performance, so that the moisture transmittance of the backboard is 0.001g / m<2>*d; the production cost of the backboard is lowered, the backboard moisture transmittance is reduced, the radiation performance of the cell component is increased, and the service life of the cell component is prolonged.

The invention discloses an ejector assisted slab-type loop heat pipe which comprises a main loop and a bypath loop; in the main loop, a capillary core in an evaporator is connected with a gas collection channel; an overheating gaseous working medium at an outlet of the gas collection channel injects a saturated gaseous working medium from a compensating chamber through an ejector; the mixed gaseous working medium is connected with an inlet of a condenser by a gas line pipeline; an outlet of the condenser is connected with an inlet of the compensating chamber by a liquid line pipeline; the compensating chamber and the capillary core are longitudinally processed together; the capillary core, the gas collection channel and the compensating chamber are wrapped in a housing of the evaporator; in the bypass loop, a saturated gaseous working medium generated from liquid gasification by absorption of heat leakage in the compensating chamber passes through a regulating valve and then enters the ejector; and through changing the opening of the regulating valve, the flow of the saturated gaseous working medium gasified in the compensating chamber due to different heat leakage quantity is ensured to be led away. The ejector assisted slab-type loop heat pipe is an economical, effective, and feasible improvement scheme, and the performance of the loop heat pipe can be improved effectively.

The invention relates to a junction box which safely dissipates heat produced by electrical / electronic components assembled in the box. The junction box has a housing with cover and at least one component chamber that juts out from a side wall of the housing. The component chamber has cooling fins. An electric or electronic component, sheathed in insulation, is inserted into the component chamber, such that it fits firmly against the walls of the chamber. The cover has cooling fins and overhangs the body of the housing and the component chamber in several areas. The construction of the junction box with the component chambers that jut out from the body and the housing cover with overhang enhance heat dissipation and allow the box to be used with solar modules in which bypass flows up to 16 A and greater occur.

A projection lighting apparatus is disclosed for marking and demarcation applications in airports, waterways, and industrial environments. The lighting apparatus comprises a plurality of high intensity LEDs with their output coupled to the input ends of a plurality of optical fibers. The output ends of the optical fibers are packaged to form a desired illumination pattern. The illumination pattern is projected onto the target surface through a secondary optical system for marking and demarcation enhancement.

The cooling tower contains the dispersed pinwheels (3) being piled in layers or the defogging pin wheels (5), the liquid blasting unit sandwiched in-between and without any fillers (4). The pinwheel contains radiating layered thin needle pin (15). The rotary thin needle pins form the rotational flow with consistent argular speed. The specific surface area of the fluid beads and the degree of evendistribution are increased through the decentralization of the nozzles, the rotational flow and the collision between the fluid beads and the thin needle pins. The rotational flow further increases the speed of centripetal heat transfer to increase heat dissipation effect and intensity so as to make the heat dissipation course be flattened and radial. The layered pinwheels and sprinkles and the crossing current cooling of the tower body increase

The invention provides a stator used for a motor, the motor and a ventilation cooling method of the motor. The stator used for the motor comprises concentrated windings and at least two wedge blocks arranged at the gaps between the adjacent concentrated windings. The at least two wedge blocks are distributed on the concentrated windings in a staggered mode to form a first ventilation path. According to the stator used for the motor, the motor and the ventilation cooling method of the motor, the concentrated windings can be cooled effectively, the concentrated windings are effectively constrained in the circumferential direction through the at least two wedge blocks, the service life of the motor is further prolonged, and the reliability of the motor is improved.

The invention relates to a bio-floccule, a preparation method thereof, and an application thereof in aquaculture, water purification, industrial water treatment, and soil repairing and improvement. The bio-floccule includes decayed straw powder, a first microbial agent, nitrifying bacteria and denitrifying bacteria. The first microbial agent includes bacillus subtilis and optional actinomycetes. The preparation method includes the following steps: adding the microbial agent and then adding the nitrifying bacteria and denitrifying bacteria successively to the decayed straw powder. The bio-floccule is prepared with the decayed straw powder as a main body and by addition of the special microbial agent, nitrifying bacteria and denitrifying bacteria. The main technical indices of the bio-floccule reach and even are better than foreign bio-floccules in the same type. In addition, a test proves that the bio-floccule has excellent purifying effects on sewage in river channels.

The invention provides a terahertz quantum cascade laser device structure and a production method thereof. The terahertz quantum cascade laser device structure at least comprises a ridge waveguide structure, wherein the ridge waveguide structure comprises a semi-insulating GaAs substrate, a GaAs buffer layer, a lower contact layer, an active region, an upper contact layer, a heat-conducting insulating layer, an upper metal layer and a lower metal layer. By depositing the heat-conducting insulating layer and covering metal on the side surface of the device, a transverse heat dissipation channel is provided for a device, so that the device has stronger heat dissipation capability compared with THz QCL uncovered by metal on the sidewall. A flip chip packaging method is adopted, and a supporting substrate adopts a high heat-conductivity material such as silicon, so that the heat dissipation capability of the supporting substrate is improved compared with the normal semi-insulating GaAs substrate for packaging the device, and the supporting substrate has a relatively large electrode area and also is favorable for the heat dissipation of the device. The novel structure is used for improving the temperature characteristics and the energy efficiency of THz QCL, thus being favorable for working in a continuous or high-duty-cycle pulse state; the device can be produced by a standard semiconductor process, and the production method of the device is suitable for industrial mass production.

The invention discloses a wheeled crane and a hydraulic oil cooling system and control method thereof. The disclosed cooling system comprises a radiator, a power part driving the radiator, a detection part, a control part and an execution part, wherein the detection part is used for detecting the temperature of hydraulic oil; the control part receives a temperature signal of the hydraulic oil, compares the temperature with the preset temperature, and generates a control signal according to the comparison information; and the execution part controls the power part to work or stop according to the control signal. By the coordinated operation of the detection part, the control part and the execution part, the radiator can be automatically started or stopped, so as to enable the temperature of the hydraulic oil to be always maintained in the preset temperature range, reduce the possibility of super high temperature, simultaneously prolong the service life of the hydraulic elements of the system and give play to the optimum heat dissipation function of the cooling system. At the same time, the start or stop of the radiator can be automatically controlled, thus the work of operators can be reduced, the dependence of the system safety on the manual operation can be reduced and the safe reliability of the system can be improved.

The invention discloses a transformer electric conduction structure which comprises a main level winding unit (300), a printed circuit board (5) and a secondary winding unit (400) which is composed of a plurality of conducting chips (4). Each conducting chip (4) comprises an annular main body (41) and an output end (42) which is arranged on the outer edge of the annular main body (41) and protrudes towards outside. The annular main body (41) of each conducting chip (4) and the main level winding unit (300) are arranged in a stagger mode. The output end of each conducting chip (4) is directly connected with the printed circuit board (5) in a clamping mode. The invention further discloses a transformer, an output path of the transformer is effectively reduced, alternating current loss and direct current loss are reduced, the size of transformer components is reduced, and power density and efficiency of a power source are improved.

The invention discloses a vertical convector radiator and comprises a vertical convector radiating down lamp of the vertical convector radiator. The vertical convector radiator comprises light source installation parts and a plurality of heat radiating fins of which the lower ends are connected with the light source installation parts in a heat conducting mode, wherein the vertical convector radiator comprises a plurality of convection passageways which penetrates through and is vertical to the upper surface and the lower surface of the convector radiator. When the vertical convector radiator in the technical scheme adopted operates, the lower end of the heat dissipation rectangular fin continuously heats the neighbouring air and the air rises, simultaneously, the neighbouring cold air can continuously complement to generate convection, thus the vertical convector radiator of the specific implement method can form a higher air velocity field even under the passive voice radiating condition, full heat exchange is generated between the cold air and the heat dissipation rectangular fin surface of the vertical convector radiator, the heat is rapidly take away, thereby avoiding the generation of the heat island effect in the bottom of the radiator, and the heat dissipation capacity is greatly improved.

A display device comprising a display panel for displaying an image, a chassis base coupled to the display panel to support the display panel, the chassis base having at least one chassis base hole, and at least one reinforcing member formed on the chassis base such that the at least one reinforcing member covers the at least one chassis base hole.

The present invention provides a vacuum cleaner motor which comprises a housing, a stator core, a rotor core, fixed impeller, wind cover, dynamic impeller, stator winding, rotor winding and a heat radiation fan, wherein the heat radiation fan is fixed on a output shaft between bearing and a commutator; gap is left between outer edge of the excircle of fan blade of the heat radiation fan and wall of inner circumference. The design proposal can, on one hand, blow cold wind to the commutator, the rotor winding, the stator winding and a carbon brush assembly directly, on the other hand make the rotor winding, the commutator and the heat radiation fan move in dynamic balance with heat radiation structure simple and heat radiation effect very good, also service life and use security of the dry & wet vacuum cleaner can be effectively enhanced.

A light emitting diode package includes a silicon substrate having a first surface and a second surface opposite to the first surface, wherein the first surface includes a cavity, a light emitting diode chip fixed on a bottom of the cavity, and a glass lens secured to the silicon substrate and covering the light emitting diode chip.

According to one embodiment of the invention, a method of die attach includes providing a chip, forming a heat conductive metal layer outwardly from a backside of the chip, and coupling the chip to a substrate. The heat conductive metal layer has a thickness of at least 0.5 mils.

The invention provides a corrosion resistant coating for metal magnesium and a preparation method thereof. The coating has favorable corrosion resistance. The preparation method has the advantages of simple process and low production cost and is suitable for industrial production. The corrosion resistant coating used for metal magnesium comprises the following chemical compositions in percentage by weight: 40-45wt% of alloy powder, 3-6wt% of titanium carbonitride powder, 3-6wt% of silicon nitride powder, 7-8wt% of butanol and the balance of epoxy resin liquid. The grain sizes of alloy powder,titanium carbonitride powder and silicon nitride powder are 270-800 meshes. The alloy powder comprises the following components in percentage by weight: 2-4wt% of Cu, 0.01-0.1wt% of Sn, 0.2-0.4wt% ofSb, 3-6wt% of Si, 0.03-0.09wt% of Pr and the balance of Ni.

An oil bath-based natural circulation and heat pipe-coupled battery pack thermal management system relates to an automotive battery thermal management system. The invention aims to solve the problem that overlying heating and dried-up electrolyte of a present power battery pack lead to swelling, fire breakout and explosion of the power battery pack. The oil bath-based natural circulation and heat pipe-coupled battery pack thermal management system contains multiple heat pipes and multiple circulating pipes. A single battery adopts vacuum seal. An evaporator section of each heat pipe is arranged inside a power battery box, and a condensation section of the heat pipe passes through the top cap of the box body to be arranged outside the power battery box. A phase-change material is arranged inside the heat pipe. Residual space of the power battery box is filled with transformer oil. Left and right walls of a housing are both provided with multiple circulating pipes. One end of each circulating pipe is communicated with the upper part of the housing, and the other end of the circulating pipe is communicated with the lower part of the housing. Thus, natural circulation of transformer oil is formed. The system provided by the invention is used for power battery thermal management.