39results about How to "Improve voltage breakdown performance" patented technology

The invention relates to an optical engine structure with a same substrate. The optical engine structure comprises the substrate, wherein LED light sources and LED constant current drivers are integrated on the substrate, and the LED constant current drivers are electrically connected with the LED light sources, and are used for converting the input DC or AC into steady-flow current to be supplied for the LED light sources to enable the LED light sources to emit illumination light after the electro-optical conversion is completed. According to the structure, the LED constant current driver as well as LED chips or lamp beads are integrated on the substrate, forming a standardized design of the LED light sources is facilitated, moreover, the matching of the LED constant current drivers and the LED chips is excellent, stable light source output can be formed, the improvement of the light efficiency can be facilitated, and the structure is excellent in thermal conduction, and has high voltage breakdown resistance performance.

The invention relates to a multi-ceramic-layer patterned structure substrate for optical and electronic devices. The multi-ceramic-layer patterned structure substrate comprises a metal substrate, wherein a voltage-withstanding ceramic layer and a high heat-conducting ceramic layer are sequentially formed on the metal substrate; a transition layer is arranged between the voltage-withstanding ceramic layer and the high heat-conducting ceramic layer; multiple isolation bases are formed by selective etching on the high heat-conducting ceramic layer and the transition layer through a mask; and a metal circuit layer is formed on every isolation base. The multi-ceramic-layer patterned structure substrate for optical and electronic devices has a metal substrate in a relatively large size, can accommodate multiple optical and / or electronic devices, and is provided with good electrical isolation and thermal isolation between the multiple optical and / or electronic devices.

The invention relates to a multi-ceramic-layer LED packaging structure which comprises a metal substrate, wherein a voltage-withstanding ceramic layer and a high heat-conducting ceramic layer are sequentially formed on the metal substrate; a metal circuit layer and a fluorescent ceramic layer are formed on the high heat-conducting ceramic layer; and an LED chip is arranged on the metal circuit layer and the fluorescent ceramic layer. The printed circuit board has multiple functional ceramic layers, and fulfills aims of thermal conductivity, resistance to high-voltage breakdown and improvement of luminous efficiency.

The invention relates to a multilayered composite ceramic layer patterned structure substrate for optical and electronic devices. The multilayered composite ceramic layer patterned structure substrate comprises a metal substrate, wherein a voltage-withstanding ceramic layer and a high heat-conducting ceramic layer are sequentially formed on the metal substrate; an active brazing layer is arranged between the voltage-withstanding ceramic layer and the high heat-conducting ceramic layer; multiple isolation bases are formed by selective etching performed on the high heat-conducting ceramic layer and the active brazing layer through a mask; and a metal circuit layer is formed on every isolation base. The multilayered composite ceramic layer patterned structure substrate for optical and electronic devices has a metal substrate in a relatively large size, can accommodate multiple optical and / or electronic devices, and is provided with good electrical isolation and thermal isolation between the multiple optical and / or electronic devices.

A distributed active transformer on a semiconducting substrate is provided. The distributed active transformer includes an outer primary, a secondary disposed adjacent to the outer primary, and an inner primary disposed adjacent to the outer primary and the secondary. A plurality of first three terminal devices is coupled to the outer primary at a plurality of locations. A plurality of second three terminal devices coupled to the inner primary at a plurality of locations, and each second three terminal device is disposed opposite from and coupled to one of the plurality of first three terminal devices. A plurality of power control actuation circuits is also provided, where each power control actuation circuit is coupled to one of the first three terminal devices and the second three terminal devices.

A distributed active transformer on a semiconducting substrate is provided. The distributed active transformer includes an outer primary, a secondary disposed adjacent to the outer primary, and an inner primary disposed adjacent to the outer primary and the secondary. A plurality of first three terminal devices is coupled to the outer primary at a plurality of locations. A plurality of second three terminal devices coupled to the inner primary at a plurality of locations, and each second three terminal device is disposed opposite from and coupled to one of the plurality of first three terminal devices. A plurality of power control actuation circuits is also provided, where each power control actuation circuit is coupled to one of the first three terminal devices and the second three terminal devices.

The invention discloses a multipurpose wave absorbing film which comprises a PET insulation layer, a composite metal layer, a wave absorbing layer and a release material layer. A first adhesive layer is disposed between the PET insulation layer and the composite metal layer. A second adhesive layer is disposed between the composite metal layer and the wave absorbing layer. The composite metal layer is overlapped by a copper layer and an aluminum foil layer. The surface, contacting with the wave absorbing layer, of the composite metal layer is provided with a plurality of first prism protruding parts and second prism protruding parts, the first prism protruding parts are higher than the second prism protruding parts, and the first prism protruding parts and the second prism protruding parts are arranged alternately. A third adhesive layer, a polypropylene film layer and a fourth adhesive layer are sequentially disposed between the wave absorbing layer and the release material layer. The multipurpose wave absorbing film has the advantages that by the composite metal layer, multi-time absorbing can be formed, tape wave absorbing performance is increased evidently, heat dissipation is facilitated, film upwarp caused by temperature rise is avoided, and product performance stability is increased.

The invention discloses a wave-absorbing plate for electromagnetic shielding. The wave-absorbing plate comprises graphite flake used as a reflecting layer, a wave-absorbing layer and a release material layer. A first adhesive layer is arranged between the graphite flake and the wave-absorbing layer. A second adhesive layer is disposed between the wave-absorbing layer and the release material layer. The wave-absorbing layer is composed of the following ingredients: a wave-absorbing powder, butyl acrylate, acrylic acid, 2-ethylhexyl acrylate, methyl methacrylate, vinyl acetate, methacrylic acid-2-hydroxyl ethyl, sodium polyacrylat and methylethyl ketone peroxide. The wave-absorbing powder is composed of the following ingredients: BaFe12O19, nickel sesquioxide, nano-graphite powder, cobalt naphtenate, unsaturated polyester and an acrylic leveling agent. Attenuation rate of the wave-absorbing plate reaches 88% at 2-10 GHz of electromagnetic wave, thus being beneficial to gluing of a polymer and uniform dispersing of mixed powders in the polymer. Therefore, reliability of electromagnetic property is guaranteed.

The invention discloses a coating slurry based on a linear aromatic polymer compound, a preparation method and an application thereof, and a battery shell. The coating slurry comprises a polar solvent, the linear aromatic polymer compound and a binder in a mass ratio of (88-98):(1-10):(1-6), the linear aromatic polymer compound is PEEK, PES, PPTA, PMIA or PI, and the battery shell comprises a shell and a coating formed by coating the inner wall of the shell with the coating slurry. The coating has good acid and alkali resistance and strong electric field resistance, is not corroded and degraded in an electrolyte system, well prevents the electrolyte from being in contact with any one of metal shells, and plays a role in protecting the shell and a pole group.

The present invention provides a thermal conduction coating material, which comprises 50-75% of a PUA oligomer, 0.5-20% of 2-(2-ethoxyethoxy)ethyl acrylate, 0.2-10% of ethylene glycol diacrylate, 1-10% of a photoinitiator, 1-10% of nanometer powder, 0.2-1% of a dispersant, and 0.2-1% of a coupling agent, and can form a thermal conduction coating after the coating material is subjected to ultraviolet light curing. The invention further provides a composite heat dissipation film, which sequentially comprises a thermal conduction coating (I), a graphite sheet (II) and a double-sided adhesive layer (V) from top to bottom, has advantages of excellent bending resistance, excellent voltage breakdown resistance and excellent radiation heat dissipation performance, can effectively reduce the heat source temperature, and can meet the use requirements in the heat dissipation field.

The invention discloses a shielding film with a high heat-conducting coefficient. The shielding film comprises a PET insulating layer, a metal layer, a wave absorbing layer and a release material layer, wherein a first adhesive layer is arranged between the PET insulating layer and the metal layer, and a second adhesive layer is arranged between the metal layer and the wave absorbing layer; the wave absorbing layer comprises the following components in parts by weight: 100 parts of wave absorbing powder, 25-35 parts of butyl acrylate, 12-15 parts of acrylic acid, 20-35 parts of 2-ethylhexyl acrylate, 10-30 parts of methyl methacrylate, 1-3 parts of vinyl acetate, 0.1-1 part of methacrylic acid-2-hydroxy ethyl acrylate, 0.5-2 parts of sodium polyacrylate and 0.4-1 part of methyl ethyl ketone peroxide; the wave absorbing powder comprises the following components in parts by weight: 100 parts of barium ferrite powder, 18-25 parts of nickel sesquioxide, 8-12 parts of nano graphite powder, 8-12 parts of cobalt chloride, 60-70 parts of unsaturated polyester and 40-50 parts of sodium dodecyl benzene sulfonate. The shielding film disclosed by the invention has the advantages that the over concentration of heat is avoided, the benefit for heat dissipation is achieved, the upwarping of the film due to temperature rise is also avoided and the stability of the performance of a product is improved.

The invention provides a polypropylene voltage-resisting insulating resin and a preparation method thereof. The polypropylene voltage-resisting insulating resin comprises the following components in parts by mass: 100 parts of mixed resin and 0.5-5 parts of silicon dioxide, wherein the mixed resin comprises the following components in parts by mass: 10-30 parts of pre-irradiated polypropylene resin, 45-80 parts of polypropylene resin and 10-25 parts of polypropylene-polystyrene resin. The invention further provides the preparation method of the polypropylene voltage-resisting insulating resin. The polypropylene voltage-resisting insulating resin is good in voltage breakdown resistance and the breakdown field strength is up to 33.2KV / mm.

The invention relates to a wave absorbing plate for electronic equipment. The wave absorbing plate comprises a wave absorbing material layer and a polyester film layer, wherein the polyester film layer covers the upper surface of the wave absorbing material layer, and the lower surface of the wave absorbing material layer is coated with a pressure-sensitive adhesive layer; a piece of release paperis stuck on the surface, opposite to the wave absorbing material layer, of the pressure-sensitive adhesive layer; the wave absorbing material layer is formed by cutting a composite wave absorbing material; specifically, the composite wave absorbing material takes rubber as a substrate and uses sisal fibers and carbon nano tubes as filler, and is prepared by mixing; the sisal fibers and the carbonnano tubes are evenly distributed in the substrate.

The electric energy transmission assembly comprises at least one electric connection framework, an insulating layer connected to the outer wall of the electric connection framework in a sleeving mode and connectors arranged at the two ends of the electric connection framework, the electric connection framework is provided with at least one bending part, and the electric energy transmission assembly is arranged in at least one part of the bending part. And at least one cavity is arranged between the inner wall of the insulating layer and the periphery of the electric connection framework. The arrangement of the structure can ensure that the safety of the electric energy transmission system is greatly improved.

The invention discloses a high-heat-radiation wave-absorption shielding film. A third adhesive layer, a polypropylene film layer and a fourth adhesive layer are sequentially arranged between a wave-absorption layer and a release material layer of the shielding film; a plurality of convex points are arranged on the contact surfaces of the fourth adhesive layer and the release material layer; the wave-absorption layer is prepared from the following ingredients including 100 parts of wave absorption powder, 20 to 35 parts of butyl acrylate, 10 to 20 parts of acrylic acid, 20 to 35 parts of 2-ethylhexyl acrylate, 10 to 30 parts of methyl methacrylate, 1 to 3 parts of vinyl acetate, 0.1 to 1 part of methacrylate-2-HEA, 0.5 to 2 parts of polyacrylate sodium and 0.4 to 1 part of methyl ethyl ketone peroxide; the wave absorption powder is prepared from the following ingredients including 100 parts of carbonyl iron powder, 60 parts of nickel sesquioxide, 9 parts of nanometer graphite powder, 15parts of cobalt chloride, 62 parts of unsaturated polyester and 42 parts of sodium dodecyl benzene sulfonate. The high-heat-radiation wave-absorption shielding film is favorable for diffusing the heat generated by electromagnetic waves; the performance stability is improved; the service life of the product is prolonged.

The invention discloses a multifunctional protection film for an electronic product. The multifunctional protection film comprises a PET insulating layer, a metal layer, a wave-absorbing layer and a release material layer, wherein a first adhesive layer is arranged between the PET insulating layer and the metal layer, a second adhesive layer is arranged between the metal layer and the wave-absorbing layer, a third adhesive layer is arranged between the wave-absorbing layer and the release material layer, and the surface, contacting with the wave-absorbing layer, of the metal layer is provided with a plurality of prism lug bosses arranged in parallel. The wave-absorbing layer comprises 100 parts of wave-absorbing powder, 25 to 35 parts of butyl acrylate, 12 to 15 parts of acrylic acid, 20 to 35 parts of 2-ethylhexyl acrylate, 10 to 30 parts of methyl methacrylate, 1 to 3 parts of vinyl acetate, 0.1 to 1 part of 2-hydroxyethyl methacrylate, 0.5 to 2 parts of sodium polyacrylate and 0.4 to 1 part of methylethyl ketone peroxide. The multifunctional protection film prevents excess concentration of heat, is beneficial for heat diffusion, avoids upwarp of the film caused by temperature rise and improves stability of product performance.

The invention discloses a processing method of an electronegative multilayer OPC drum. The processing method comprises the following steps that S1, a dispersing agent, an anti-settling agent and titanium dioxide are taken, a mixture containing one or more of phenolic resin, acrylic resin and nylon resin is added to an alcohol solution, and a charge blocking layer material solution is prepared; S2,a charge generating layer material solution and a charge transmission layer material solution are prepared; S3, pretreatment is carried out on a pixel pipe, and successively the surface of the pixelpipe is subjected to coating in sequence, so that a charge blocking layer, a charge generating layer and a charge transmission layer are sequentially formed on the surface of the pixel pipe from inside to outside; and S4, stepped baking is carried out on the pixel pipe, then the pixel pipe is taken out for aging, and the finished OPC drum is obtained. According to the processing method of the electronegative multilayer OPC drum, modification is carried out on the charge blocking layer material arranged on the OPC drum in a coating manner, and the thixotropic property of the material solution is improved, so that the good sagging property is achieved when the coating thickness is relatively thick, and the uniformity of the subsequent coating is guaranteed when the thickness of the charge blocking layer is increased.

The invention discloses an electric energy transmission connecting device and a vehicle, the electric energy transmission connecting device comprises at least one electric connection framework and a connector connected with two ends of the electric connection framework, the connector is internally provided with at least one fixed cavity, and the end part of the electric connection framework extends to form a terminal structure. And the terminal structure is at least partially arranged in the fixed cavity, and the terminal structure realizes an electric connection function of the connector. According to the electric energy transmission connecting device, the electric energy transmission connecting device and the terminal structure can be prevented from being broken due to vibration in the using process, and the stability of the structure between the terminal structure and the electric connection framework is enhanced.

The invention discloses a protective adhesive tape with a wave absorbing function. The protective adhesive tape includes a PET insulating layer, a metal layer, a wave absorbing layer and a release material layer. A first adhesive layer is arranged between the PET insulating layer and the metal layer. A second adhesive layer is arranged between the metal layer and the wave absorbing layer. A surface of the metal layer, which is contacted with the wave absorbing layer, is provided with several parallel prism lug bosses. A third adhesive layer, a polypropylene film layer and a fourth adhesive layer are successively arranged between the wave absorbing layer and the release material layer. A surface of the fourth adhesive layer, which is contacted with the release material layer, is provided with several convex points. According to the protective adhesive tape with the wave absorbing function of the invention, a utilization rate of a reflection electromagnetic field of the metal layer can be increased; wave absorbing performance of the protective adhesive tape can be significantly improved; and over concentration of heat can be avoided, which is good for heat diffusion.

The invention provides a polypropylene voltage-resisting insulating resin and a preparation method thereof. The polypropylene voltage-resisting insulating resin comprises the following components in parts by mass: 100 parts of mixed resin and 0.5-5 parts of silicon dioxide, wherein the mixed resin comprises the following components in parts by mass: 10-30 parts of pre-irradiated polypropylene resin, 45-80 parts of polypropylene resin and 10-25 parts of polypropylene-polystyrene resin. The invention further provides the preparation method of the polypropylene voltage-resisting insulating resin. The polypropylene voltage-resisting insulating resin is good in voltage breakdown resistance and the breakdown field strength is up to 33.2KV / mm.

The invention discloses a composite pasting film with the electromagnetic field shielding function. The composite film comprises a PET insulating layer, a metal layer, a wave absorbing layer and a release material layer. A first adhesive layer is disposed between the PET insulating layer and the metal layer, a second adhesive layer is arranged between the metal layer and the wave absorbing layer, and a plurality of parallel prism protruding parts are arranged on the surface, making contact with the wave absorbing layer, of the metal layer. The wave absorbing layer is formed by mixing the components comprising, by weight, 100 parts of wave absorbing powder, 20-35 parts of butyl acrylate, 10-20 parts of acrylic acid, 20-35 parts of 2-ethylhexyl acrylate, 10-30 parts of methyl methacrylate, 1-3 parts of vinyl acetate, 0.1-1 part of methacrylic acid-2-hydroxyethyl, 0.5-2 parts of sodium polyacrylate and 0.4-1 part of methyl ethyl ketone peroxide. The composite pasting film with the electromagnetic field shielding function increases the utilization rate of a reflection electromagnetic field of the metal layer, remarkably improves wave absorbing performance of protective adhesive tape, avoids over-concentration of heat and facilitates heat diffusion.

The invention relates to a patterned composite ceramic layer printed circuit substrate for optical and electronic devices. The patterned composite ceramic layer printed circuit substrate comprises a metal substrate, wherein a composite ceramic layer that is voltage-withstanding and is high in thermal conductivity; multiple isolation bases are formed by selective etching performed on the composite ceramic layer through a mask; and a metal circuit layer is formed on every isolation base. The patterned composite ceramic layer printed circuit substrate for optical and electronic devices has a metal substrate in a relatively large size, can accommodate multiple optical and / or electronic devices, and is provided with good electrical isolation and thermal isolation between the multiple optical and / or electronic devices.

The present invention relates to a high reliability SMD? The LED packaging structure includes a metal base, and a pressure-resistant ceramic layer is formed on the metal base, and a metal circuit layer and a high thermal conductivity ceramic layer are formed on the pressure-resistant ceramic layer; and on the metal circuit layer and high SMD is provided on the thermally conductive ceramic layer? LED? Lamp beads. The high reliability SMD described in the present invention? In the LED packaging structure, the thermal conductivity of the high thermal conductivity ceramic layer is greater than 50? W / mK,? Lateral and radial heat conduction can be realized, and the voltage-resistant ceramic layer has high voltage-resistant breakdown performance.

The invention relates to a multi-layer composite ceramic layer patterned structural substrate for optical and electronic devices, which includes a metal base, and a pressure-resistant ceramic layer and a high thermal conductivity ceramic layer are sequentially formed on the metal base; the pressure-resistant There is an active brazing layer between the ceramic layer and the high thermal conductivity ceramic layer, and the high thermal conductivity ceramic layer and the active brazing layer are selectively etched through a mask to form a plurality of isolation bases; There are metal circuit layers. The multilayer composite ceramic layer patterned structural substrate for optical and electronic devices described in the present invention has a larger size metal substrate and can accommodate multiple optical and / or electronic devices, and the multiple optical and / or have good electrical and thermal isolation between electronic devices.

The invention relates to a multi-ceramic-layer LED packaging structure which comprises a metal substrate, wherein a voltage-withstanding ceramic layer and a high heat-conducting ceramic layer are sequentially formed on the metal substrate; a metal circuit layer and a fluorescent ceramic layer are formed on the high heat-conducting ceramic layer; and an LED chip is arranged on the metal circuit layer and the fluorescent ceramic layer. The printed circuit board has multiple functional ceramic layers, and fulfills aims of thermal conductivity, resistance to high-voltage breakdown and improvement of luminous efficiency.

The invention relates to an ultraviolet (UV)-curable paint, a coating and a graphite heat dissipation material. The UV-curable paint is prepared from 50-75% of a polyurethane acrylate (PUA) oligomer, 0.5-20% of an active diluent (1), 0.2-10% of an active diluent (2), 0.05-10% of an active diluent (3), 1-10% of a photoinitiator and 0.05-0.4% of an auxiliary agent, wherein the active diluent (1) is prepared from ethoxyethoxyethyl acrylate, the active diluent (2) is prepared from ethylene glycol diacrylate, and the active diluent (3) is prepared from hydroxyl acrylate and / or tetrahydrofurfuryl acrylate. The paint can be subjected to ultraviolet curing, heating does not need to be carried out in the curing process, and a solvent is not evaporated in the curing process; after a graphite sheet substrate is coated with the paint and the paint is cured, the coating is low in shrinkage rate; the graphite heat dissipation material has excellent bending resistance, voltage breakdown resistance, wear resistance and flexibility; the coating has better adhesion force with substrates such as the graphite sheet substrate, and is an environment-friendly material.

The invention relates to a multi-ceramic layer patterned structural substrate for optical and electronic devices, which includes a metal base, and a pressure-resistant ceramic layer and a high-thermal-conduction ceramic layer are sequentially formed on the metal base; the pressure-resistant ceramic layer There is a transition layer between the high thermal conductivity ceramic layer and the high thermal conductivity ceramic layer and the transition layer through a mask to form a plurality of isolation bases; and a metal circuit layer is formed on the isolation base. The multi-ceramic layer patterned structure for optical and electronic devices described in the present invention has a larger size metal substrate and can accommodate multiple optical and / or electronic devices, and the multiple optical and / or electronic There is good electrical and thermal isolation between devices.

The invention discloses a multifunctional protection film for an electronic product. The multifunctional protection film comprises a PET insulating layer, a metal layer, a wave-absorbing layer and a release material layer, wherein a first adhesive layer is arranged between the PET insulating layer and the metal layer, a second adhesive layer is arranged between the metal layer and the wave-absorbing layer, a third adhesive layer is arranged between the wave-absorbing layer and the release material layer, and the surface, contacting with the wave-absorbing layer, of the metal layer is provided with a plurality of prism lug bosses arranged in parallel. The wave-absorbing layer comprises 100 parts of wave-absorbing powder, 25 to 35 parts of butyl acrylate, 12 to 15 parts of acrylic acid, 20 to 35 parts of 2-ethylhexyl acrylate, 10 to 30 parts of methyl methacrylate, 1 to 3 parts of vinyl acetate, 0.1 to 1 part of 2-hydroxyethyl methacrylate, 0.5 to 2 parts of sodium polyacrylate and 0.4 to 1 part of methylethyl ketone peroxide. The multifunctional protection film prevents excess concentration of heat, is beneficial for heat diffusion, avoids upwarp of the film caused by temperature rise and improves stability of product performance.