30results about How to "Increase heat transfer limit" patented technology

The invention discloses a phase change heat dissipation device which comprises a phase change component, wherein a phase change heat exchange medium is internally arranged in the phase change component, the phase change component comprises an evaporation part and a condensation part; an evaporation cavity is formed in the evaporation part, a condensation cavity is formed in the condensation part,and the evaporation cavity communicates with the condensation cavity; a heating source is directly contacted with the evaporation cavity, the phase change heat exchange medium in the evaporation cavity can absorb heat of the heating source and moves toward the condensation cavity; and the condensation cavity can outward dissipate heat to cool the heating source. In the phase change heat dissipation device, the phase change component is directly contacted with the heating source, without increasing a transitional thermal conductive plate, an appearance of the evaporation part is adapted to thatof the heating source, the phase change component can fully contact with the heating source, a heat transfer area is big, and a temperature difference between the heating source and the phase changeheat exchange medium is minimum.

The invention discloses a heat pipe and a manufacturing method of the heat pipe. The heat pipe and the manufacturing method of the heat pipe can achieve cooling of electronic devices and a device. According to the heat pipe, a pipe shell is arranged on the outermost portion, a steam chamber is formed in the innermost portion, the steam chamber is divided into an evaporation segment, a thermal insulation segment and a condensation segment in the axial direction of the steam chamber, the thermal insulation segment is arranged in the middle, the evaporation segment and the condensation segment are arranged at the two ends respectively, a cylindrical capillary liquid absorption core layer formed by a multi-hole foamy copper liquid absorption core is closely attached to the inner wall of the pipe shell, holes in the multi-hole foamy copper liquid absorption core are different in hole diameter, a silk screen supporting frame is closely attached to the inner wall of the capillary liquid absorption core layer, the steam chamber is filled with a metal oxide water-based nanofluid working medium, the volume of the nanofluid working medium is 40% to 60% that of the evaporation segment, and metal oxide is aluminum oxide or copper oxide or silicon dioxide. According to the heat pipe and the manufacturing method of the heat pipe, nanofluid and multi-hole foamy copper are combined in the heat pipe, and the heat transfer efficiency of the heat pipe is improved.

A heat dissipation device for high-power LED lamps, belonging to the technical field of LED heat dissipation, comprising an upper lampshade, a circuit board, a heat dissipation fan, a finned shell, a gas-liquid pulsation phase change heat pipe, a mounting base, an LED bead integrated board, a lower lampshade, and a glass The device consists of a gas-liquid pulsation phase change heat pipe as the core heat transfer component, which efficiently transmits the heat generated by the high-power LED lamp bead array at the bottom to the three-dimensional space and quickly dissipates it; the self-wetting fluid working fluid filled in the tube It can automatically wet the evaporation section of the heat pipe, which can effectively improve the "dry-out" limit of the heat pipe; the capillary suction force generated by the micro-grooves on the inner wall of the heat pipe can also enhance the wettability of the working medium to the inner wall of the entire pipe, thereby further improving its Uniform temperature and heat transfer limit; compared with existing metal fin LED lighting cooling devices and traditional heat pipe LED lighting cooling devices such as capillary heat pipes and gravity heat pipes, this device has better heat transfer performance, higher Heat transfer limit and better work adaptability.