Lead-free welding tin wire and water-soluble welding flux used by same

[0056] (Example 1, lead-free solder wire)

[0057] This embodiment is a lead-free solder wire, which includes a copper-tin alloy wire with a cavity and a water-soluble flux arranged in the cavity; the ratio of the copper-tin alloy wire and the water-soluble flux is:

[0058] Water-soluble flux 2.0%;

[0059] Copper tin alloy wire 98%;

[0060] The copper-tin alloy wire includes the following components:

[0061] Cu 0.75%;

[0062] Sn 99.25%;

[0063] The water-soluble flux includes the following components:

[0064] Coconut oil alkyl primary amine 20%;

[0065] Stearylamine polyoxyethylene ether 30%;

[0066] Diethylamine hydrochloride 1%;

[0067] Water-soluble high molecular polymer 49%;

[0068] The above percentages are mass percentages;

[0069] The ammonium salt halide is diethylamine hydrochloride;

[0070] The water-soluble high molecular polymer is polyethylene glycol with a molecular weight of 200 to 600 and a hydroxyl value of 51 to 64.

[0071] See Table 1 for the materials and their ...

[0072] (Example 2, lead-free solder wire)

[0073] Example 2 is basically the same as Example 1, except that the ratio of the copper-tin alloy wire and the water-soluble flux in this example is:

[0074] Water-soluble flux 2.2%;

[0075] Copper-tin alloy wire 97.8%;

[0076] In addition, the ratio of the water-soluble flux used in this embodiment is different from that in Embodiment 1. The relevant parameters in this embodiment are shown in Table 1.

[0077] (Example 3, lead-free solder wire)

[0078] Embodiment 3 is basically the same as embodiment 1, except that the ratio of copper-tin alloy wire and water-soluble flux in this embodiment is:

[0079] Water-soluble flux 2.1%;

[0080] Copper-tin alloy wire 97.9%;

[0081] In addition, the ratio of the water-soluble flux used in this embodiment is different from that in Embodiment 1. The relevant parameters in this embodiment are shown in Table 1.