The invention relates to 
soldering fluid technique, which is a 
modified technique based on prior art, specifically relates to a 
mildew resistant antibiotic low-corrosivity water-based 
soldering fluid, comprising components with following percentage by weight (): 1.0% of 
active agent, 1.0% of micro-enwrapping agent, 0.1% of surfactant, 0.01% of 
mildew resistant antibiotic agent, residue is 
solvent of de-ionized water, and the weight sum of each components are 100 The advantages of the invention are: the 
soldering fluid contains no volatile 
organic matter or 
halide, and can inhibit development of microorganisms such as 
bacteria and fungi and 
mildew; circuit and conveyor are not eroded during 
welding, no cleaning is needed after welded, and the soldering fluid is safe and environmentally-friendly; the soldering fluid can be coated on the PCB plate weld face by spraying, dipping or foaming mode to implement leadless 
welding of electronic products. The invented soldering fluid is practical and has great 
market potential.