380 results about "Bonds hydrogen" patented technology

A method of manufacture of a silicone grip, comprising coating a solution of a silicone composition onto a substrate surface to form a silicone layer, wherein the solution comprises: a catalyst that promotes cure of the silicone composition, a higher molecular weight organopolysiloxane having at least two alkenyl groups per molecule, a lower molecular weight organopolysiloxane having at least two alkenyl groups per molecule, an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, and a solvent; and curing the silicone layer to form the silicone grip conformable with the substrate surface, wherein the cured silicone layer has a Shore A Durometer of less than or equal to about 60.

A silicone grip comprising a cured silicone film layer with a Shore A Durometer of less than or equal to about 60 wherein the silicone film layer is formed from a curable silicone composition comprising a catalyst that promotes cure of the silicone composition, a higher molecular weight organopolysiloxane having at least two alkenyl groups per molecule, a lower molecular weight organopolysiloxane having at least two alkenyl groups per molecule, and an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule. The cured silicone layer is used in combination with an adhesive to provide a flexible and malleable grip, and / or in combination with a backing layer that can be solid or foamed.

A composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two unsaturated organic groups per molecule, with the proviso that component (I) is free of fluorine atoms; optionally (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, with the proviso that component (II) is free of fluorine atoms; (III) a hydrosilylation catalyst; (IV) a fluoroorganosilicone, with the provisos that (1) component (IV) has at least one functional group reactive with component (I), component (II), or both, (2) when component (II) is not present, then component (IV) has an average of at least two silicon-bonded hydrogen atoms per molecule, and (3) component (IV) is added to the composition in an amount sufficient to provide chemical resistance to a cured product of the composition; and (V) an adhesion promoter.

An article comprises a flexible support layer having an exterior surface and an interior surface; and a silicone grip disposed on, conformable, and in contact with the exterior surface of the flexible support layer, wherein the silicone grip comprises: a cured silicone layer with a Shore A Durometer of less than or equal to about 60 and having an exterior surface and an opposite, interior surface, wherein the silicone layer is formed from a curable silicone composition comprising a catalyst that promotes cure of the silicone composition, a higher molecular weight organopolysiloxane having at least two alkenyl groups per molecule, a lower molecular weight organopolysiloxane having at least two alkenyl groups per molecule, and an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule.

A method of making a light emitting device is disclosed. The method includes providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a photopolymerizable composition consisting of a silicon-containing resin and a metal-containing catalyst, wherein the silicon-containing resin consists of silicon-bonded hydrogen and aliphatic unsaturation, and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.

A hydrosilylation process is used to prepare a polyorganosiloxane having clustered functional groups at the polyorganosiloxane chain terminals. The ingredients used in the process include a) a polyorganosiloxane having an average of at least 2 aliphatically unsaturated organic groups per molecule, b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule and at least 4 silicon bonded hydrogen atoms for each aliphatically unsaturated organic group in ingredient a), c) a reactive species having, per molecule at least 1 aliphatically unsaturated organic group and 1 or more curable groups; and d) a hydrosilylation catalyst. The resulting clustered functional polyorganosiloxane is useful in a curable silicone composition for electronics applications.

A silicone grip comprising a cured silicone film layer with a Shore A Durometer of less than or equal to about 60 wherein the silicone film layer is formed from a curable silicone composition comprising a catalyst that promotes cure of the silicone composition, a higher molecular weight organopolysiloxane having at least two alkenyl groups per molecule, a lower molecular weight organopolysiloxane having at least two alkenyl groups per molecule, and an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule. The cured silicone layer is used in combination with an adhesive to provide a flexible and malleable grip, and / or in combination with a backing layer that can be solid or foamed.

A mat comprises a backing layer having a top surface and a bottom surface; a silicone grip disposed on, conformable, and in contact with the top surface of the backing layer to form a topside of the mat, wherein the silicone grip comprises: a cured silicone layer with a Shore A Durometer of less than or equal to about 60 and having an exterior surface and an opposite, interior surface; and wherein the silicone layer is formed from a curable silicone composition comprising a catalyst that promotes cure of the silicone composition, a higher molecular weight organopolysiloxane having at least two alkenyl groups per molecule, a lower molecular weight organopolysiloxane having at least two alkenyl groups per molecule, and an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule.

An electrically conductive silicone composition comprising an electrically conductive filler; organopolysiloxane mixture comprising a catalyst which promotes the addition of Si-bonded hydrogen onto alkenyl multiple bonds; an organopolysiloxane having at least two alkenyl groups per molecule; an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; optionally, a fluid organopolysiloxane having a viscosity less than about 1000 centipoise; and optionally, an organopolysiloxane gel formulation, the composition, when cured, having a Shore A Durometer hardness of less than or equal to about 60 measured according to ASTMD-2240 and an electrical resistivity of less than or equal to about 10-6 ohm-cm.

A thermal interface material composition including a blend of a polymer matrix and a thermally conductive filler having particles having a maximum particle diameter no greater than about 25 microns, wherein the polymer matrix includes an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule and a hydrosilyation catalyst comprising a transition metal, wherein the transition metal is present in an amount of from about 10 to about 20 ppm by weight based on the weight of the non-filler components and the molar ratio of the silicon-bonded hydrogen atoms to the silicon-bonded alkenyl groups ranges from about 1 to about 2. A method is also provided.

A polyorganosiloxane containing the units (HR2Si-O1 / 2) HM units, (Si-O4 / 2) Q units, (R1Si-O3 / 2) T units and (R2Si-O2 / 2) D units in a ratio of from 2:1:0:0 to 6:4:2:2, or (HR2Si-O1 / 2) HM units, (R1Si-O3 / 2) T units, (R2Si-O2 / 2) D units and (R2(R1O)Si-O1 / 2) in a ratio HM:T:D:alkoxyM of from 1:2:0:0 to 3:4:2:2 is described, where R are identical or different, non-halogenated or halogenated hydrocarbon radicals having from 1 to 18 carbon atoms per radical, or are OR1, where R1 is a monovalent, unsubstituted or substituted hydrocarbon radical having from 1 to 8 carbon atoms, and in each molecule there are at least 3 Si-bonded hydrogen atoms. The polyorganosiloxanes are particularly useful as crosslinking agents in addition curable elastomer formulations.

The invention relates to self-adhesive addition-crosslinking silicone compositions which comprises(A) diorganopolysiloxanes, (B) organohydrogenpolysiloxanes containing less than 20 SiH bonded hydrogen atoms and less than 12% aryl groups, (C) organosilicon compounds having epoxy groups and hydrolyzable groups and (D) a hydrosilylation catalyst. The compositions are transparent to translucent, exhibit good compositional comparability, and cure to form strongly adhesive elastomers with good physical properties.

An electrically conductive silicone composition comprising an electrically conductive filler; organopolysiloxane mixture comprising a catalyst which promotes the addition of Si-bonded hydrogen onto alkenyl multiple bonds; an organopolysiloxane having at least two alkenyl groups per molecule; an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; optionally, a fluid organopolysiloxane having a viscosity less than about 1000 centipoise; and optionally, an organopolysiloxane gel formulation, the composition, when cured, having a Shore A Durometer hardness of less than or equal to about 60 measured according to ASTMD-2240 and an electrical resistivity of less than or equal to about 10−6 ohm-cm.

The present invention relates to a hydrosilation-curable organopolysiloxane resin composition comprising (A) an organopolysiloxane resin having three or more monovalent unsaturated aliphatic hydrocarbon groups and aromatic hydrocarbon carbon groups, (B) an organosilicon compound having two or more silicon-bonded hydrogen atoms and aromatic hydrocarbon groups, (C) a hydrosilation catalyst, and optionally (D) (d1) a solvent or (d2) a hydrosilation-reactive organosiloxane-based diluent, for optical transmission components, especially for optical transmission components serving as optical communication elements, relates to optical transmission components, represented by optical waveguides, comprisiong a hydrosilation-cured product of the aforementioned organopolysiloxane resin and organosilicon compound, and relates to a process for fabricatiing optical transmission components.

Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds and having a viscosity of 100-1,000,000 mPa·s at 25° C., (B) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms (SiH groups) in the form of HR62SiO-, and (C) a platinum group metal base catalyst cure into colorless transparent parts which are useful lenses.

A continuous method for performing a hydrosilylation reaction comprising effecting a hydrosilylation reaction between a liquid organosilicon compound (A) having in each molecule at least one silicon-bonded hydrogen atom and a liquid organosilicon compound (B) having in each molecule at least one aliphatic unsaturated bond in the presence of a platinum catalyst (C) continuously in a tubular reactor equipped with a stirring and plug-flow maintaining apparatus located within the reactor.

A curable organopolysiloxane composition capable of forming cured products of superior optical transmittance exhibiting little heat-induced yellowing over time. A semiconductor device having semiconductor elements encapsulated in a cured product of the composition. The composition includes (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule and bearing silicon-bonded aryl groups, whose content relative to all silicon-bonded organic groups is not less than 40 mol %, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, and (C) an organosiloxane oligomer complex of platinum, where the oligomer has not more than eight silicon atoms per molecule and bears silicon-bonded alkenyl groups and silicon-bonded aryl groups.

A composition includes: (I) a polyorganosiloxane fluid having an average of at least two unsaturated organic groups per molecule, (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, (III) a hydrosilylation catalyst; and (IV) a fluoroorganosilicone.

A sponge-forming liquid silicone-rubber composition comprising: a diorganopolysiloxane (A) comprising a diorganopolysiloxane (A1) that has alkenyl groups on both molecular terminals and does not have any alkenyl groups in molecular side chains; and a diorganopolysiloxane (A2) that has two or more alkenyl groups in molecular side chains; an organohydrogenpolysiloxane (B) that has in one molecule at least two silicon-bonded hydrogen atoms; a mixture (C) composed of water and inorganic thickener; an emulsifier (D); a hydrosilylation-reaction catalyst (E); and a curing retarder (F). The aforementioned sponge-forming liquid silicone-rubber composition provide a silicone-rubber sponge that has a reduced coefficient of shrinkage upon molding, does not bleed out non-cross-linked components, and has a fine, uniform, and continuous porosity.

Perfluoropolyether compositions are provided comprising (A) a linear perfluoropolyether compound containing at least two alkenyl groups, having a perfluoropolyether structure comprising recurring units —CaF2aO— in its backbone, and having a Mw of 10,000-100,000; (B) an organosilicon compound containing at least two silicon atom-bonded hydrogen atoms; (C) a reinforcing filler; (D) a hydrosilylation catalyst; and (E) a polyfluoromonoalkenyl compound containing one alkenyl group and having a perfluoropolyether structure in its backbone. The compositions cure into rubber or gel products having improved acid resistance.

Reinforced silicone resin films comprising at least two polymer layers, wherein at least one of the polymer layers comprises a cured product of a at least one silicone resin having an average of at least two silicon-bonded alkenyl groups or silicon-bonded hydrogen atoms per molecule, and at least one of the polymer layers comprises a carbon nanomaterial.

A curable silicone composition includes (A) a polydiorganosiloxane having an average, per molecule, of at least two aliphatically unsaturated organic groups and at least one aromatic group; (B) a branched polyorganosiloxane having an average, per molecule, of at least one aliphatically unsaturated organic group and at least one aromatic group; (C) a polyorganohydrogensiloxane having an average per molecule of at least two silicon-bonded hydrogen atoms and at least one aromatic group, (D) a hydrosilylation catalyst, and (E) a silylated acetylenic inhibitor. The curable silicone composition cures to form a cured silicone resin having a refractive index >1.40. The curable silicone composition cures by heating to form a cured silicone resin with an optical transparency >95% at a thickness of 2.0 mm or less at 400 nm wavelength after thermal aging by heating at 200° C. for 14 days.

A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO3 / 2, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.

A thermal interface material composition including a blend of a polymer matrix and a thermally conductive filler having particles having a maximum particle diameter no greater than about 25 microns, wherein the polymer matrix includes an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule and a hydrosilyation catalyst comprising a transition metal, wherein the transition metal is present in an amount of from about 10 to about 20 ppm by weight based on the weight of the non-filler components and the molar ratio of the silicon- bonded hydrogen atoms to the silicon-bonded alkenyl groups ranges from about 1 to about 2. A method is also provided.

A silicone rubber adhesive film comprising a composition formed from; (A) organopolysiloxane gum that has at least two alkenyl groups in each molecule; (B) wet-method hydrophobic reinforcing silica that has a specific surface area of at least 200 m2 / g; (C) organohydrogenpolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule; (D) mixture or reaction mixture from: (a) organopolysiloxane that has a branched molecular chain structure and that contains at least one silicon-bonded alkenyl group in each molecule and at least one silicon-bonded hydrolyzable group in each molecule, and (b) a silicon-containing compound that contains at least one silicon-bonded epoxy-functional hydrocarbon group and at least one silicon-bonded hydrolyzable group; and (E) curing accelerator.

A hydrosilylation process is used to prepare a polyorganosiloxane having clustered functional groups at the polyorganosiloxane chain terminals. The ingredients used in the process include a) a polyorganosiloxane having an average of at least 2 aliphatically unsaturated organic groups per molecule, b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule and at least 4 silicon bonded hydrogen atoms for each aliphatically unsaturated organic group in ingredient a), c) a reactive species having, per molecule at least 1 aliphatically unsaturated organic group and 1 or more curable groups; and d) a hydrosilylation catalyst. The resulting clustered functional polyorganosiloxane is useful in a curable silicone composition for electronics applications.

Provided is a curable silicone resin composition including (A) a siloxane / polycyclic hydrocarbon-based compound containing at least 2 silicon-bonded hydrogen atoms, which is an addition reaction product of (a) a siloxane-based compound with at least 3 silicon-bonded hydrogen atoms, and (b) a polycyclic hydrocarbon with at least 2 addition reactive carbon-carbon double bonds, (B) a siloxane-based compound containing at least 2 silicon-bonded alkenyl groups, and (C) a hydrosilylation reaction catalyst. This composition is useful as a material for optical devices or parts, insulation material for electronic devices or parts, or coating material.

A curable silicone rubber composition characteristically comprising (A) an alkenyl-containing organopolysiloxane comprising (A-1) a dialkylpolysiloxane that has an average of at least two alkenyl groups in each molecule and (A-2) an alkenyl-containing, resin-form organopolysiloxane that comprises the SiO4 / 2 unit, R<1>2R<2>SiO1 / 2 unit, and R<1>3SiO1 / 2 unit wherein R<1> is C1-10 alkyl and R<2> is alkenyl and that contains the alkenyl group in the range from more than 2.5 mass% to not more than 5.0 mass%; (B) an organopolysiloxane that contains the silicon-bonded hydrogen atom; and (C) a hydrosilylation reaction catalyst in a catalytic quantity and provides a cured silicone material that has a hardness is not more than 75 and the elongation is at least 35%. Also, a composite in which the cured silicone material provided by the thermosetting of the curable silicone rubber composition is integrated into a single article with a substrate.

A temporary adhesive for which temporary adhesion and subsequent detachment are simple. The temporary adhesive composition includes: (A) an organopolysiloxane having a weight-average molecular weight of at least 15,000, obtained by a hydrosilylation reaction between (A1) and (A2) described below, and (B) an organic solvent having a boiling point of not more than 220° C., wherein (A1) is an alkenyl group-containing organopolysiloxane having a weight-average molecular weight exceeding 2,000, comprising 35 to 99 mol % of T siloxane units and 1 to 25 mol % of M siloxane units, and in which alkenyl groups bonded to silicon atoms represent at least 2 mol % of all the organic groups bonded to silicon atoms, and (A2) is a specific organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms or a specific hydrosilyl group-containing compound.

An electrically conductive silicone rubber composition comprises, at least, (A) 100 parts by weight of an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule (an amount sufficient to cure the present composition), (C) a platinum based catalyst (an amount sufficient to promote the cure of the present composition), (D) 50 parts by weight to 5,000 parts by weight of a metal based electrically conductive filler, and (E) 5 parts by weight to 500 parts by weight of spherical silicone rubber particles with a surface active agent content of not more than 0.3 wt %.