The subject invention provides for a novel 
photomultiplier assembly, termed the 
Microstructure Photomultiplier Assembly (MPA), which enables the effective conversion of light signals (received at the front of the 
assembly) into readily-detectable electrical signals. The MPA comprises a 
photocathode (which converts light into electrons and which is located in front of or on the front surface of the 
assembly), followed by an 
electron-multiplying plate, or series of plates, each made from an insulating substrate which does not emit sufficient contaminants to poison the 
photocathode. Each plate is coated on the front and rear faces with a conductive layer. In addition, the front face of each plate is further coated with a layer of secondary 
electron-emissive material which, when struck by an incoming 
electron, can produce 
secondary electrons. Each plate is perforated with channels (with non-conducting walls) and the number and geometry of these channels is designed to promote the efficient transfer and acceleration of electrons through the channel, under an applied 
voltage differential across the plate(s). The number of plates placed in series is determined by the desired degree of 
electron multiplication. At the exit of the last plate, an 
anode is located to collect the electrons and generate an electrical 
signal that can be read by conventional 
electronics. The 
anode can be a simple 
anode or can be a position-sensitive anode. The spacing between the 
photocathode, the electron-multiplying plates, and the anode is selected to promote the efficient transfer and acceleration of electrons across the assembly, as well as to promote the efficient production of 
secondary electrons. The photocathode, electron-multiplying plate(s) and anode are all contained within a vacuum 
enclosure.