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1533 results about "Electronic chip" patented technology
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Apparatus for energizing a remote station and related method
InactiveUS6615074B2Eliminate needEasy to useElectrotherapyTelemetry/telecontrol selection arrangementsStored energyMiniaturization
Owner:PITTSBURGH UNIV OF
Gate linewidth tailoring and critical dimension control for sub-100 nm devices using plasma etching
InactiveUS6864041B2Tight tolerance variationMinimal variationVacuum gauge using ionisation effectsDecorative surface effectsImage resolutionLine width
A method of fabricating an electronic chip on a wafer in which a first mask at a predetermined lower resolution is developed on the wafer and then etched under a first set of conditions for a predetermined period to achieve a mask that is below the resolution limit of current lithography. The etched mask is then used as a hard mask for etching material on a lower layer.
Owner:INT BUSINESS MASCH CORP
Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate
ActiveUS7990711B1Simple actionSemiconductor/solid-state device detailsSolid-state devicesElectricityCarrier fluid
A plurality of heat-dissipating electronic chips are arranged in a vertical chip stack. The electronic chips have electronic components thereon. A cold plate is secured to a back side of the chip stack. A silicon carrier sandwich, defining a fluid cavity, is secured to a front side of the chip stack. An inlet manifold is configured to supply cooling fluid to the cold plate and the fluid cavity of the silicon carrier sandwich. An outlet manifold is configured to receive the cooling fluid from the cold plate and the fluid cavity of the silicon carrier sandwich. The cold plate, the silicon carrier sandwich, the inlet manifold, and the outlet manifold are configured and dimensioned to electrically isolate the cooling fluid from the electronic components. A method of operating an electronic apparatus and a method of manufacturing an electronic apparatus are also disclosed. Single-sided heat removal with double-sided electrical input-output and double-sided heat removal with double-sided electrical input-output are also disclosed.
Owner:GLOBALFOUNDRIES US INC
Thinning in package using separation structure as stop
ActiveUS20150108666A1Without risk of quality deteriorationImprove accuracySemiconductor/solid-state device detailsSolid-state devicesStructure functionEngineering
A method of forming a thinned encapsulated chip structure, wherein the method comprises providing a separation structure arranged within an electronic chip, encapsulating part of the electronic chip by an encapsulating structure, and thinning selectively the electronic chip partially encapsulated by the encapsulating structure so that the encapsulating structure remains with a larger thickness than the thinned electronic chip, wherein the separation structure functions as a thinning stop.
Owner:INFINEON TECH AG
Thinning in package using separation structure as stop
ActiveUS9627287B2Without risk of quality deteriorationImprove accuracySemiconductor/solid-state device detailsSolid-state devicesStructure functionElectronic chip
A method of forming a thinned encapsulated chip structure, wherein the method comprises providing a separation structure arranged within an electronic chip, encapsulating part of the electronic chip by an encapsulating structure, and thinning selectively the electronic chip partially encapsulated by the encapsulating structure so that the encapsulating structure remains with a larger thickness than the thinned electronic chip, wherein the separation structure functions as a thinning stop.
Owner:INFINEON TECH AG
Electronic card table and method
InactiveUS20060058092A1Apparatus for meter-controlled dispensingVideo gamesComputer hardwareElectronic chip
An electronic card game provides an electronic card game to a plurality of players on an electronic card table. The electronic card table includes a table top with a playing surface and a plurality of electronic player interaction areas located around a periphery of the table top. Each electronic player interaction area provides a player interface for interaction with one of the players. A server computer administers the electronic card at the electronic card table using electronic cards and electronic chips. The electronic card table reports information regarding play of the electronic card game to the server computer. The server computer stores the information in a database.
Owner:POKERTEK
Electronic card table and method with variable rake
ActiveUS20060058087A1Card gamesApparatus for meter-controlled dispensingElectronic chipHuman–computer interaction
A system and method provides an electronic poker game to a plurality of players on an electronic poker table. A game computer administers the electronic poker game by dealing one or more hands using electronic cards and electronic chips. Each hand includes one or more betting rounds. The game computer allows the players to make wagers into a pot with the electronic chips during the one or more betting rounds. The game computer dynamically determines a rake amount of a pot and retains the rake amount from the pot.
Owner:JACKPOT DIGITAL INC
System and method for playing an electronic card game
InactiveUS20060058090A1Card gamesApparatus for meter-controlled dispensingDatabase serverHuman–computer interaction
A system provides an electronic card game to a plurality of players on an electronic card table. The electronic card table has a table top with a playing surface and a plurality of electronic player interaction areas located around a periphery of the table top. Each electronic player interaction area provides a player interface for interaction with one of the players. A database maintains a player account for each player. Each player account includes identification information and a monetary amount. A server computer is coupled to the plurality of electronic player interaction areas and the database for administering the electronic card game using electronic cards and electronic chips. The server computer allows each player to log-in to one of the electronic player interaction areas, draw down at least a portion of the monetary amount in their player account, and purchase electronic chips using the drawn down portion of the monetary amount.
Owner:POKERTEK
System and method for providing a card tournament using one or more electronic card table
InactiveUS20060058082A1Apparatus for meter-controlled dispensingVideo gamesComputer hardwarePlaying card
A system and method provides a card tournament on one or more electronic card tables. The card tables have a table top with a playing surface and a plurality of electronic player interaction areas located around a periphery of the table top. Each electronic player interaction area provides a player interface for interaction with one of a plurality of players. A tournament computer is coupled to the electronic player interaction areas of the electronic card table for administering the card tournament. The card tournament includes a series of card hands of a card game played at the electronic card table using electronic cards and electronic chips.
Owner:POKERTEK
Functionally improved battery and method of making same
InactiveUS6855441B1Extended service lifePower outputBatteries circuit arrangementsSemiconductor/solid-state device detailsElectrical batteryLiquid state
A functionally improved battery is disclosed. The battery includes a flexible thin layer open liquid state electrochemical cell (10) and an electronic chip device (60) integrally formed on or within the electrochemical cell (10). The cell (10) includes a first layer of insoluble negative pole (14), a second layer of insoluble positive pole (16) and a third layer of aqueous electrolyte (12). The third layer (12) is disposed between the first (14) and second (16) layers. The third layer (12) includes a diliquescent material for keeping the cell wet, an electroactive soluble material for ionic conductivity and a watersoluble polymer for viscosity. The viscosity adheres the first (14) and second (16) layer to the third layer (12). The chip (60) serves to improve the functionality of the battery.
Owner:POWER PAPER
Heat Dissipation System With A Plate Evaporator
ActiveUS20080283223A1Indirect heat exchangersCooling/ventilation/heating modificationsLiquid lineEngineering
A heat dissipation system is provided. The heat dissipation system includes: an evaporator having a plate chamber with the wick structures which has a plurality of pore sizes arranged in the plate chamber, a condenser, a vapor line, and a liquid line. The two-phase circulation of the vapor-condensate in the heat dissipation system, especially in the heat dissipation system with a plate evaporator, can effectively increase the heat conductivity of the plate heat source such as electronic chip. The design and composition of the wick structures are enormously decreased the turning-on temperature of the heat dissipation system and maintained the heat dissipation system in the balancing state under the low heat source power.
Owner:IND TECH RES INST
Method of fabricating integrated electronic chip with an interconnect device
ActiveUS6864165B1Improve reliabilityLow costSemiconductor/solid-state device detailsSolid-state devicesElectrical conductorHigh density
A method is described for forming an integrated structure, including a semiconductor device and connectors for connecting to a motherboard. A first layer is formed on a plate transparent to ablating radiation, and a second layer on the semiconductor device. The first layer has a first set of conductors connecting to bonding pads, which are spaced with a first spacing distance in accordance with a required spacing of connections to the motherboard. The second layer has a second set of conductors connecting to the semiconductor device. The first layer and second layer are connected using a stud / via connectors having spacing less than that of the bonding pads. The semiconductor device is thus attached to the first layer, and the first set and second set of conductors are connected through the studs. The interface between the first layer and the plate is ablated by ablating radiation transmitted through the plate, thereby detaching the plate. The connector structures are then attached to the bonding pads. This method permits fabrication of a high-density packaged device with reduced cost.
Owner:VEECO INSTR
Optical navigation sensor with integrated lens
InactiveUS6967321B2Reduce in quantityOptimize generation and captureInput/output for user-computer interactionBeam/ray focussing/reflecting arrangementsForeign matterImaging lens
An optical navigation sensor apparatus for an optical mouse includes an optical navigation sensor having an electronic chip, an aperture plate and an imaging lens integrated into a single package. The imaging lens includes a lens housing surrounding the aperture and providing a barrier to the entry of foreign matter into the aperture. In one form, the optical navigation sensor also includes a light emitting diode (LED) for illuminating a small area of a surface under the sensor and generating a reflected image that is detected by the electronic chip. In a sensor having an integral LED, an integral collimating lens is included for receiving light from the LED and focusing the light from the LED on the surface to be illuminated. The collimating lens is incorporated into a lens housing surrounding the LED and protecting the LED from exposure to foreign material.
Owner:SAMSUNG ELECTRONICS CO LTD
Cashless electronic poker table and method
InactiveUS20060068869A1Apparatus for meter-controlled dispensingResourcesHuman–computer interactionElectronic chip
A system and method provides an electronic poker game to a plurality of players using an electronic poker table. The electronic poker table has a table top with a playing surface and a plurality of electronic player interaction areas located around a periphery of the table top. Each electronic player interaction area provides a player interface for interaction with one of the players. The electronic poker table includes at least one device coupled to the electronic poker table for reading tickets having an associated value. A game computer administers the electronic poker game by using electronic cards and electronic chips, associates the value of a first ticket read by the at least one device with one of the players and allows the one player to purchase electronic chips with at least a portion of the value of the first ticket.
Owner:POKERTEK
Electronic card table having a display device for implementing electronic player interaction areas
InactiveUS20060068865A1Apparatus for meter-controlled dispensingResourcesDisplay deviceHuman–computer interaction
An electronic poker table provides an electronic poker game to a plurality of players. The electronic poker table includes a table top, a display device, and a game computer. The display device forms a plurality of a plurality of player interaction areas located around a periphery of the table top. Each player interaction area provides a player interface for interaction with one of the players. The game computer is coupled to the display device for dealing a hand of the electronic poker game composed of electronic cards, displaying the electronic cards on the electronic player interface areas and administering the electronic poker game using electronic chips and the electronic cards.
Owner:POKERTEK
Method and apparatus for packaging an electronic chip
InactiveUS20060170081A1Accurate locationRemove heatSemiconductor/solid-state device detailsSolid-state devicesLead bondingLead frame
An electronic packaging combines features of a MAP (molded array package) and a lead frame package. The package includes an electrically conductive substrate somewhat like a lead frame package but defines a grid of conductive pads rather than a multiplicity of leads as is common with a lead frame package. An electronic chip is attached to the top surface of the lead frame, and the output terminals of the electronic chip are individually electrically connected to selected connecting pads of the lead frame grid array. Both flip chips and wire bond chips may be connected to the grid array. The channels defining the grid of connecting pads extend part way through the conductive substrate and increase in width from the top surface of the lead frame to the bottom of the channel such that the molding compound is locked in place when it cures and hardens. The grid pads are then singulated by sawing or etching channels from the bottom surface of the lead frame substrate that correspond to the channels defining the connecting pads on the top surface.
Owner:TEXAS INSTR INC
Apparatus for energizing a remote station and related method
InactiveUS20030032993A1Eliminate needEasy to useElectrotherapyTelemetry/telecontrol selection arrangementsStored energyMiniaturization
Apparatus for remote interaction with an object of interest includes a remote station for obtaining information from the object of interest, a base station for transmitting energy in space to and communicating with the remote station and the remote station having conversion means for energizing the remote station responsive to receipt of the transmitted energy. The energy may be of any suitable type including RF power, light, acoustic, magnetic energy or other form of space transmitted or "radiant" energy. The remote station does not have to contain a source of stored energy or a wired connection to a source of energy. The remote station receives the energy transmission and data transmission from the base station and transmits data to the base station. Microprocessor controllers may be provided for the base station and the remote station. The remote station may receive information from sensors and through one or more transponders sequentially communicate information to the base station. An associated method is provided. In other embodiments which are suited for use in miniaturized electronic chip systems, power enhancement and increased effective antenna size are provided.
Owner:PITTSBURGH UNIV OF
Electronic card table and method
InactiveUS20060068866A1Apparatus for meter-controlled dispensingResourcesDisplay deviceHuman–computer interaction
An electronic poker table provides an electronic poker game to a plurality of players. The electronic poker table includes a table top, a plurality of display devices, and a game computer. The display devices are located around a periphery of the table top. Each display device implements an electronic player interaction area. The game computer is coupled to the plurality of electronic player interaction areas and administers the electronic poker game using electronic chips and the electronic cards.
Owner:POKERTEK
Integrated sensor and electronics package
InactiveUS6891239B2Reduce path lengthReduce capacitanceSemiconductor/solid-state device detailsSolid-state devicesElectrical connectionEngineering
An integrated sensor and electronics package wherein a micro-electromechanical sensor die is bonded to one side of the package substrate, one or more electronic chips are bonded to an opposite side of the package substrate, internal electrical connections run from the sensor die, through the package substrate, and to the one or more electronic chips, and input / output connections on the package substrate are electrically connected to one or more of the electronic chips.
Owner:CHARLES STARK DRAPER LABORATORY
Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon
InactiveUS6927156B2Semiconductor/solid-state device detailsSolid-state devicesLead bondingBonding process
A method and apparatus for making pad structures suitable for wirebonding and, optionally, also for solder-ball connections. Some embodiments include an electronics chip having a substrate with circuitry, a compliant electrically insulating layer deposited on at least a portion of the substrate, and an electrical connection pad, the pad having an electrical connection to the circuitry through an aperture in the insulating layer and a peripheral bonding zone region extending over the insulating layer. In some embodiments, the bonding zone is exclusively over the insulating layer outside of the aperture. In some embodiments, the pads are suitable for both solder-ball and wirebond connections. By making a wirebond connection to an area of a pad over the compliant insulating layer, the underlying circuitry is protected from ultrasonic energy of the bonding process.
Owner:TAHOE RES LTD
Method for assembling at least one chip using a fabric, and fabric including a chip device
A method for assembling a device on two substantially parallel taut threads. The device includes an electronic chip and two substantially parallel grooves open on opposite sides of the device. The distance separating the grooves corresponds to the distance separating the threads. The device presents a penetrating shape along an axis perpendicular to the plane of the grooves, having a base at the level of the grooves and an apex of smaller size than the distance separating the threads. The method includes the steps consisting in placing the apex of the device between the two threads; in moving the device between the two threads resulting in the threads being separated from one another by the penetrating shape of the device; and in continuing movement of the device until the threads penetrate into the grooves reverting to their initial separation distance.
Owner:COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
Front side illuminated photodiode with backside bump
ActiveUS7038288B2Increase speedReduce areaSolid-state devicesMaterial analysis by optical meansFiberCommunications system
This invention relates to a novel optoelectronic chip with one or more optoelectronic devices, such as photodiodes, fabricated on a front side of a semiconductor wafer and contacts on a backside of the semiconductor wafer. The backside contacts can be contact bumps, which allow the optoelectronic chip to achieve the benefits of flip chip packaging without flipping the optoelectronic chip upside down with respect to a chip carrier. In an optical communication system, a photodiode chip can be backside bumped to a chip carrier or an electronic chip, allowing front side illumination of the photodiode chip. Front side illumination offers many benefits, including improved fiber alignment, reduced manufacturing time, and overall cost reduction.
Owner:MICROSEMI
Passive Transmitter Receiver Device Fed by an Electromagnetic Wave
InactiveUS20070252763A1Simple and small solutionEfficient use ofAntenna supports/mountingsRadiating elements structural formsEngineeringElectronic chip
The invention relates to a passive transmitter-receiver device (6,28,33) fed by an electromagnetic wave, provided with an antenna comprising a loop (7, 30, 34) which is associated with an electronic transponder chip (9), said loop being able to feed the electronic chip by an induced current which is generated when it is cross-flown by an electromagnetic wave (H1, H2, H3, Ha, Hr) carrying information, and to transmit a second electromagnetic wave carrying a response from the electronic chip. The antenna is configured in such a way that the loop includes at least two non-coplanar or non-parallel parts in a position of use.
Owner:PYGMALYON
Method and apparatus for providing parallel optoelectronic communication with an electronic device
ActiveUS20050058408A1Coupling light guidesOptical waveguide light guideMultiplexingElectronic systems
An optoelectronic assembly for an electronic system includes a support electronic chip set configured for at least one of providing multiplexing, demultiplexing, coding, decoding and optoelectronic transducer driving and receive functions. A first substrate having a first surface and an opposite second surface is in communication with the support electronic chip set via the first surface while a second substrate is in communication with the second surface of the first substrate. The second substrate is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support electronic chip set and an optical fiber array is aligned at a first end with the optoelectronic transducer and with an optical signaling medium at a second end. An electrical signal from the support electronic chip set is communicated to the optoelectronic transducer via an electrical signaling medium, and the support electronic chip set and the optoelectronic transducer share a common thermal path for cooling.
Owner:IBM CORP
Total impedance and complex dielectric property ice detection system
InactiveUS7439877B1Improve accuracyLittle effectDe-icing equipmentsAlarmsDisplay deviceElectronic chip
An ice detection system that detects the onset of ice accreation on an aircraft's external surfaces, continuously measures its thickness and growth time history and provides the type of ice, glaze or rime, is disclosed along with an independent way to confirm that the contaminant is known to be ice and only ice. Total impedance data, thermal conductivity value and complex dielectric properties are used to discriminate between ice, water, deicing fluid and snow with measurements made by low cost, low power consumption, low profile, miniature electronic chips, components and devices collocated together on the external surface in a thin pliant patch that does not effect the airflow about the aircraft. The ice detection system provides ice accreation data and warning signals to displays and aural signaling devices in the cockpit for the pilot and to the control console of a ground controller flying the aircraft if it is unmanned.
Owner:JARVINEN PHILIP ONNI
Combinations of resin compositions and methods of use thereof
ActiveUS20050131106A1Semiconductor/solid-state device detailsSynthetic resin layered productsColloidal silicaFilling materials
A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, thereby forming a solvent-modified resin. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.
Owner:GENERAL ELECTRIC CO
Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate
ActiveUS20110205708A1Semiconductor/solid-state device detailsSolid-state devicesElectricityEngineering
A plurality of heat-dissipating electronic chips are arranged in a vertical chip stack. The electronic chips have electronic components thereon. A cold plate is secured to a back side of the chip stack. A silicon carrier sandwich, defining a fluid cavity, is secured to a front side of the chip stack. An inlet manifold is configured to supply cooling fluid to the cold plate and the fluid cavity of the silicon carrier sandwich. An outlet manifold is configured to receive the cooling fluid from the cold plate and the fluid cavity of the silicon carrier sandwich. The cold plate, the silicon carrier sandwich, the inlet manifold, and the outlet manifold are configured and dimensioned to electrically isolate the cooling fluid from the electronic components. A method of operating an electronic apparatus and a method of manufacturing an electronic apparatus are also disclosed. Single-sided heat removal with double-sided electrical input-output and double-sided heat removal with double-sided electrical input-output are also disclosed.
Owner:GLOBALFOUNDRIES US INC
Method of mounting electronic chips
ActiveUS8617927B1Semiconductor/solid-state device detailsSolid-state devicesMetallic materialsEngineering
Owner:HRL LAB
Interconnect substrate and method of manufacture thereof, electronic component and method of manufacturing thereof, circuit board and electronic instrument
InactiveUS6977441B2Simple processInsulating substrate metal adhesion improvementSemiconductor/solid-state device detailsElectronic instrumentElectronic component
An interconnect substrate including a first substrate on which a first interconnect pattern is formed, having a mounting region for an electronic chip; and a second substrate on which a second interconnect pattern electrically connected to the first interconnect pattern is formed. The second substrate includes a region to which at least a part of the first substrate is adhered, and a mounting region for an electronic chip.
Owner:SEIKO EPSON CORP
Method and apparatus for chip placement
InactiveUS6389688B1Accurate locationImprove abilitiesPrinted circuit assemblingAutomatic control devicesImaging analysisEngineering
A method and apparatus for accurately registering electronic chip bonding pads with substrate leads. Images are developed of different portions of the interface between the electronic chip and the substrate by reflecting collimated, parallel light from the bottom of the chip through transparent areas of the substrate. Image analysis of the composite, superimposed images from spaced positions containing the bonding pads and the leads provide a corrective positioning after which the electronic chip and substrate are brought into contact.
Owner:MICRO ROBOTICS SYST
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