76 results about "Package testing" patented technology

An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.

The invention discloses an automatic testing method which comprises the following steps that each testing object involved in the automatic testing process, an operating method and a parameter which are contained in each testing object, each function process and each static element are respectively packaged; a one-to-one corresponding key word is mapped for each packaged testing object, each packaged operating method, each packaged parameter, each packaged function process and each packaged static element; a testing script which is composed of at least one key word is input and resolved, so as to obtain all key words in the testing script; the packaged testing object, the packaged parameter and the packaged static element which correspond to the key words are respectively obtained in accordance with the key words which are obtained through resolution; and then the packaged operating method and the packaged function process which correspond to the key words are implemented. The invention further discloses an automatic testing system. By adopting the automatic testing method and the automatic testing system which are disclosed by the invention, the automatic testing efficiency and generality can be increased.

An integrated circuit (IC) package testing apparatus integrates a temperature sensor (48), heater (or cooler) (44), and controller (42) within a single modular unit (22, 72). The controller (42) is a microprocessor embedded within the modular unit (22, 72) and in communication with the sensor (48) and heater (44). The controller (42) allows a selected testing temperature to be input by a user via a communications link (71) to the controller (42). Each IC package (54) has its testing temperature individually controlled by a controller (42). The module is easily attached and removed from an open-top socket through the use of latches on the testing socket.

The invention discloses post-packaging test equipment for a plastic package surface mounted devices diode (SMD) diode, which relates to the technical field of semiconductor packaging test, and aims to solve the technical problems in improving the packaging test efficiency and the test quality. The equipment comprises a main base, a feeding device, a suction device and a monitoring system, wherein the suction device comprises a main supporting rotating drum, a main rotating disc, a lifting rod and a lifting disc; the main supporting rotating drum and the main rotating disc form a rotating tower structure; a plurality of suction nozzles are arranged in a circle around the axle center on the main rotating disc; the lifting disc is arranged above the main rotating disc and is fixedly connected with each suction nozzle; the upper end of the lifting rod is connected with the lifting disc through a shaft, the rod body of the lifting rod passes through the main supporting rotating drum and is coaxial with the main supporting rotating drum; and a positioning device, a polar rotating device, a test device, a material lowering device, a marking device and a packaging device are arranged right below each suction nozzle along the rotation direction of the main rotating disc respectively. The equipment provided by the invention can improve the post-packaging test efficiency of the SMD diode.

Disclosed are a chip package testing device and a lead frame used thereby. The device comprises a test processing unit, a contactor bracket and a plurality of contactor units. The lead frame is fixedly arranged on the contactor bracket. Each contactor unit is provided with a probe array composed of a plurality of contact probes, the spacing size of the contactor probes is transversely and longitudinally matched with the spacing size of pins of packaged chips on the lead frame, the contact probes are arranged on the contactor bracket in a platform contact method and are electrically connected with the pins of the packaged chips, and the number of the packaged chips is an integral multiple of the number of the contact probes contained in the contact probe arrays. An injection-molding rubber channel on the lead frame includes a plurality of capsule-shaped slots, wherein a connection gap between every two capsule-shaped slots is located in the position of one chip pin, the capsule-shaped slots are located in the end parts of the chips and are in one-to-one correspondence with the chips, and the injection-molding rubber channel is located on the upper surface of the lead frame. According to the invention, the efficiency of parallel test is improved, and the utilization rate of the lead frame and mold sealing materials is improved.

The invention discloses a method for pre-screening direct-current steady state power aging in GaN-based devices. The method includes: subjecting a GaN-based device to be tested to package testing so as to determine direct-current steady state power of the GaN-based device; measuring junction temperature of the device by an infrared microscopic thermographer, subjecting the measured junction temperature to mathematical fitting to obtain relation of the tested GaN-based device between peak junction temperature and the direct-current steady state power, and determining conditions for direct-current steady state power aging of the tested GaN-based device; subjecting the tested GaN-based device to direct-current steady state power aging to obtain time-based changing curves of characteristic parameters of the tested GaN-based device; determining level-off threshold time of the characteristic parameters of the device according to the time-based changing curves of the characteristic parameters of the GaN-based device, and determining the time of the device for direct-current steady state power aging; subjecting the tested GaN-based devices to aging screening to remove the devices with the characteristic parameters less easily stabilizing in the threshold time, and completing pre-screening of direct-current steady state power aging in the GaN-based devices.

An integrated circuit (IC) package testing device using a selectable number of leaf springs to provide a resilient and consistent normal force to the IC package and the method of operating the device. The leaf springs are shaped to provide the proper compliance and resilient force and are shaped to fit side-by-side within the lid of the device. The springs can be easily changed for differently sized IC packages.

A smart inductive heating appliance includes an interface for interacting with a package intelligence and communication module on a smart package. The smart heating appliance may also detect and charge chargeable devices inductively. A number of data sets may be utilized to enhance control of heating / cooking and to enhance safety. A thermodynamic load profile of the package may include detailed data correlations established in a package testing step and utilized to control heating of the package as well as to validate and authenticate the package.

The invention provides a software development kit testing method, a system, a computer device and a readable storage medium. The software development package testing method comprises the following steps: acquiring the update status of the software development package according to the configuration file included in the software development package to judge whether there is an updated target software development package in the software development package; Obtaining the latest software development kits when there is an updated target software development kit; Performing packaged build actions based on the latest software development packages and internal test packages. The software development kit test method provided by the invention judges whether the SDK stored on the computer equipment is updated, and packages the SDK and the internal test kit to construct action when the SDK is updated, so that the subsequent integration test and the system test can be conveniently and quickly carried out.

A method for creating test benches for digital circuit design verification (1) partitions a design for purposes of test bench creation according to circuit type, (2) identifies circuit types and creates packaged testing strategies, (3) uses ATPG techniques to create comprehensive test sequences based on the circuit type classifications, and (4) incorporates the ATPG-produced test stimuli and expected responses into the test bench templates.

A method and apparatus for testing a package design and material set comprising using a test die to form a test device and subjecting the test device to a test procedure, such as a highly accelerated stress test (HAST). In one embodiment the device, which comprises a die and a package to be tested, is constructed using a test die. The test die comprises a non-functional die having one or more conductive traces thereon. Use of a test die reduces costs as compared to a functional die and reduces the time to market by allowing package testing prior to creation and testing of a functional die. In one embodiment the test die is configure with conductive traces on its top surface to allow for biasing before, during, or after testing.

The invention discloses a box falling test device being suitable for packaging testing of a product packaged in a box body. The test device comprises a carrying platform, a driving mechanism, a pick-and-place mechanism, a test ground, a test ground conversion mechanism and a controller. The controller is connected with the driving mechanism, the pick-and-place mechanism, and the test ground conversion mechanism electrically. A plurality of impact zones with different hardness values are formed on the test ground. The test ground conversion mechanism and the test ground are connected to drive the test ground to carry out conversion among a plurality of impact zones. The driving mechanism and the pick-and-place mechanism are connected to drive the pick-and-place mechanism to move and rotate.The moving pick-and-place mechanism captures the box body and enables the box body to fall on the test ground at different heights; and the rotating pick-and-place mechanism drives the box body to rotate and thus the box body falls at different angles. According to the invention, falling testing of products at different heights and different impact positions and on different hardness grounds of products in the box body can be completed automatically; and the device has advantages of simple structure, high test efficiency and accurate detection.

The planarity of external terminals or a ball grid array on a device package can be improved through use of test probes that flatten the electrical terminals while forming the electrical contact for package testing. After testing, the package has external terminals with improved planarity that improves the electrical connections formed during assembly of a system containing the package.

The invention discloses a tightness detection device of transparent paper for cigarette packing. The tightness detection device comprises a negative pressure generation device and a sealing device, wherein the negative pressure generation device comprises a vacuum pump, the sealing device comprises a second sealing vessel and a first sealing vessel for containing water and cigarette packets to be detected, the vacuum pump is connected with the second sealing vessel by an air pipe, and the first sealing vessel and the second sealing vessel are connected by an air pipe. According to the tightness detection device of transparent paper for cigarette packing, a negative pressure soaking method is adopted to detect the tightness of the packaging transparent paper, flexible package testing can be carried out, rigid package detection also can be carried out, the leakage position and the tightness degree of the transparent paper for cigarette packing can be tested, the measurement of the tightness of transparent paper for cigarette packing can be perfected, and the operating convenience and the detecting accuracy are achieved.

A system and method for detecting lead adequacy and quality is disclosed. The system includes leads attached to a package having known electrical or optical characteristics. The package is adapted to interface with a testing device that allows the operator to ascertain whether the leads are appropriate for the desired task. This allows the testing of the lead set without the need to remove it from the package. The system of the present invention generally includes packaging of known electrical or optical characteristics, a package testing interface, and a lead testing assembly including hardware and / or software to determine whether the leads in question fulfill the desired characteristics. The lead testing assembly may be freestanding or may be incorporated into an existing testing instrument.

The invention relates to an integrated circuit testing circuit structure capable of realizing single-port multifunctional multiplexing. The circuit structure includes a port conversion module, a test state determination module, and a clock data separation module; the port conversion module converts the port between the input state and the output state, discriminates the input data and output data, realizes the data exchange between a test machine and a test circuit; the port conversion module is connected with an internal circuit and the test machine, the test state determination module determines whether an input signal determination circuit enters into the test state, the test state determination module is connected with the clock data separation module, the port conversion module and the internal circuit, the clock data separation module separates the input data into a clock signal and a data signal and transmits the input data to the internal circuit, and the clock data separation module is connected with the port conversion module and the internal circuit. By means of such a circuit structure, only one present port can realize the wafer testing and packaged testing of an integrated circuit, so that the circuit structure is wide in application.

The invention discloses a comprehensive system for measuring conduction and radiation characteristics of a packaged antenna. The comprehensive system comprises a microwave anechoic chamber, radio frequency measurement equipment, a feed source antenna, a chip suction device and a packaged test base, wherein the package testing base comprises a first base part and a second base part which can be jointed or separated; the first base part is fixedly arranged above a top plate of the microwave anechoic chamber; the chip suction device penetrates through a through hole defined by the second base part; the chip suction device is linked with the second base part; when the second base part is jointed with the first base part, the radio frequency measurement equipment is electrically connected withthe packaged antenna by means of the first base part and the second base part in sequence, so as to measure radio frequency conduction characteristic parameters of the packaged antenna; and the radiofrequency measurement equipment is further electrically connected with the feed source antenna so as to measure the radiation characteristics of the packaged antenna.

The invention provides a mobile phone hardware accelerated ageing testing method and system. The method comprises the steps that a center testing node sends a hardware accelerated ageing testing program to a to-be-tested mobile phone node; the to-be-tested mobile phone node downloads the hardware accelerated ageing testing program; the to-be-tested mobile phone node repeatedly executes the hardware accelerated ageing testing program at the interval of the preset time T1, and testing results obtained by executing the hardware accelerated ageing testing program each time are obtained; the to-be-tested mobile phone node backups the testing results; the to-be-tested mobile phone node packages the testing results and sends the packaged testing results to the center testing node, and the center testing node summarizes the testing results and generates a testing report. The mobile phone hardware accelerated ageing testing method and system have the advantages of being simple, efficient and accurate in testing.

The invention relates to the technical field of fault testing, and provides a method and a system for testing a port fault of a switch based on an MCS and a server. The method comprises the steps of:configuring a fault testing hardware environment which comprises an MCS cluster, a server and a switch; calling and starting running a preset package testing script; receiving a testing command parameter input by a tester; executing a port fault automatic testing operation after running of the package testing script; and outputting a log file generated by the automatic testing when the automatic testing is completed, wherein the log file includes a port fault testing result. Through adoption of the method of the invention, automatic testing for a newly developed function module can be achieved, an accurate testing result and a high testing efficiency are also realized.

A transport packaging testing device includes a vibration table horizontally supported on a stand through coil springs provided at four corners of the back side of the vibration table; a table surface provided on an upper face of the vibration table that holds a test object thereon with a holding fixture; a vibrator provided on the back side of the vibration table for producing vibration of a frequency corresponding to rotation speed due to unbalanced weight between a rotary shaft of a rotation drive with a longitudinally-horizontal rotational axis and an eccentric flywheel integrally interlocking with the rotary shaft; a mounting leg mounted and suspended toward a rotation drive built-in part of the vibrator; and a vibrator control part that controls normal and reverse rotation of the rotation drive. Based on the longitudinal, lateral, and vertical vibrations by the vibrator, the vibration table is subjected to triaxial simultaneous vibration.

The invention discloses a BGA package testing socket which comprises the components of a first supporting component which fixes the BGA package, a second supporting component which supports the BGA package, and a third supporting component which fixes socket needles. The first supporting component is fixed to the second supporting component. The second supporting component is fixed to the third supporting component. The first supporting component and the third supporting component are square frames. The upper part of the four sidewalls of the first supporting component is provided with a horizontal reversed-T-shaped chamber. The driving device is arranged in the chamber of the first supporting component. The BGA package testing socket has advantages of realizing simple operation, facilitating package placement, reducing working strength of an operator, and improving package test effect.

The invention provides a protection ring for preventing short circuit of a test structure, and a manufacturing method and a package testing method thereof. The protection ring comprises a separating structure, three upper medium layers and a plurality of metal pads, wherein the separating structure comprises a plurality of the same interconnection layers which are sequentially connected layer by layer from the bottom up; a metal-strip-like enclosing structure is arranged in each interconnection layer; the metal-strip-like enclosing structure is formed by grooving a low-K medium layer and filling grooves with metal; the three upper medium layers are formed in the separating structure; windows are formed in the three upper medium layers; the metal pads are formed in the low-K medium layers enclosed by the metal-strip-like enclosing structures; each window corresponds to a metal pad, thus preventing the performance worsening problem of the test structure caused by water entering the test structure in the slice packaging process or other operating process, and avoiding the short circuit problem of the test structure caused by contact of a metal ball connecting ball and the protection ring because a part of the metal ball connecting ball is outside the metal pad due to too small metal pads or operating errors.

Disclosed are a chip package testing device and a lead frame used thereby. The device comprises a test processing unit, a contactor bracket and a plurality of contactor units. The lead frame is fixedly arranged on the contactor bracket. Each contactor unit is provided with a probe array composed of a plurality of contact probes, the spacing size of the contactor probes is transversely and longitudinally matched with the spacing size of pins of packaged chips on the lead frame, the contact probes are arranged on the contactor bracket in a platform contact method and are electrically connected with the pins of the packaged chips, and the number of the packaged chips is an integral multiple of the number of the contact probes contained in the contact probe arrays. An injection-molding rubber channel on the lead frame includes a plurality of capsule-shaped slots, wherein a connection gap between every two capsule-shaped slots is located in the position of one chip pin, the capsule-shaped slots are located in the end parts of the chips and are in one-to-one correspondence with the chips, and the injection-molding rubber channel is located on the upper surface of the lead frame. According to the invention, the efficiency of parallel test is improved, and the utilization rate of the lead frame and mold sealing materials is improved.

A CMOS driver test configuration, which allows both leakage current and load current testing, using a single monitor, or current meter, located in a power lead of a tester connected to a power pad servicing the driver circuits. Both leakage testing and load current testing for CMOS drivers is described. The test configuration allows a plurality of driver circuits connected in parallel between power pads to be tested simultaneously. An ESD device, internal to the chip, is used as a load during load current testing in chip testing, and an external load is used during package testing in order to include the bonding means between the chip output pad of the driver and the package I / O pin in the current path during load current testing.

The invention discloses an inductor package testing method based on inductor package testing equipment. The equipment comprises a rack, an electrical cabinet, a packaging mechanism, a CCD detecting mechanism, a testing mechanism and a disc containing mechanism, the electrical cabinet is arranged on one side of the rack, and an operation panel is arranged on the surface of the top of the rack; thepackaging mechanism and the CCD detecting mechanism are fixed to an installing panel of the rack through bolts at the bottom of a conveying support; the testing mechanism comprises a correction mechanism, a removing mechanism and a rotary disc mechanism, and the testing mechanism is welded to the surface of the panel of the rack through a flat plate; and the disc containing mechanism is fixed to the surface of the installing panel of the rack through a supporting rod. By means of the rotary disc mechanism, the effect of improving the layout rationality of the equipment is achieved, and the function of reasonably distributing the space is achieved; by means of the correction mechanism, the effect of improving the product transporting orderliness is achieved, and the function of correcting products on a transporting line is achieved; and inductors are sucked by a sucking nozzle to the middle portion of four symmetrical clamping blocks and are clamped through clamping device, and the problem that the yield is low is solved.

An integrated circuit (IC) package testing device using a selectable number of leaf springs to provide a resilient and consistent normal force to the IC package and the method of operating the device. The leaf springs are shaped to provide the proper compliance and resilient force and are shaped to fit side-by-side within the lid of the device. The springs can be easily changed for differently sized IC packages.

The invention relates to a server packaging test line, which relates to the field of test and transportation before server packaging, and comprises a safety test table, a power-on test table, an appearance detection table, an accessory mounting table, an integral quality inspection table and a boxing table which are arranged in sequence; a plurality of unpowered rollers or balls are arranged on the safety test table, the power-on test table, the appearance detection table, the accessory mounting table, the integral quality inspection table and the boxing table in the arrangement direction; and the tangent planes of the tops of the rollers and the balls on the safety regulation test table, the power-on test table, the appearance detection table, the accessory installation table, the overall quality inspection table and the boxing table are the same horizontal plane and are higher than the safety regulation test table, the power-on test table, the appearance detection table, the accessory installation table, the overall quality inspection table and the boxing table. The test line has the advantages that the working intensity of detection personnel is relieved, the packaging efficiency is improved, and the situation that the server is collided is avoided.

The invention discloses an integrated circuit package testing device for continuous testing, being characterized in that a pair of front and rear stop blocks which are symmetrically arranged front andback are formed on each of the left and right side walls of a testing groove; the pair of front-back stop blocks on the left side and the pair of front-back stop blocks on the right side are connected into a whole through a partition plate; the continuous testing device comprises a rectangular frame-shaped test bracket; front and rear side walls of the test bracket are positioned on front and rear sides of the pair of front-back stop blocks and the partition plate; upper and lower side walls are respectively positioned on upper and lower sides of the pair of front-back stop blocks and the partition plate; the test bracket is arranged between the front and rear side walls of the testing groove in a left-right reciprocating manner; a test support plate is arranged on the upper end surface of the lower side wall of the test bracket in a lifting manner; a plurality of uniformly distributed probes are formed on the upper end surface of the test support plate; and lower support plates are rotationally arranged between the partition plate and the left and right side walls of the test groove respectively. The integrated circuit package testing device for continuous testing can complete continuous testing of integrated circuit packaging through left-right reciprocating motion of the test support, and is high in the testing efficiency.

The invention provides a single-chip microcomputer open-circuit and electric leakage tester and belongs to the field of integrated circuit package testing technologies. The single-chip microcomputer open-circuit and electric leakage tester comprises a power source unit, a main control unit, a DA conversion unit, a mode switching unit, a test unit and an AD conversion unit; the input end of the main control unit is connected with the power source unit; the output end of the main control unit is connected with the DA conversion unit; the input end of the mode switching unit is connected with theoutput end of the main control unit; the output end of the mode switching unit is connected with the input end of the DA conversion unit; the output end of the DA conversion unit is connected with the input end of the test unit; the output end of the test unit is connected with the input end of the AD conversion unit; and the output end of the AD conversion unit is connected with the input end ofthe main control unit. With the single-chip microcomputer open-circuit electric leakage tester has an open short-circuit test and electric leakage test function. With the single-chip microcomputer open-circuit and electric leakage tester adopted, an open short-circuit test and an electric leakage test can be completed quickly and efficiently, and thus, the rapid detection of possible electrical and physical defects in a package product can be achieved.