159 results about "Strain resistance" patented technology

The pressure sensor device has a laminated diaphragm (12) in which a strain resistance gauge is formed in a surface and a stopper member (13) including a concave portion forming a curved surface parallel to a surface formed by displacement of the diaphragm, the concave portion being disposed to face the diaphragm. Specifically, the concave portion of the stopper member is formed into a curved surface in which depth y at a distance x from the center of the diaphragm is expressed by a quartic function [y=pr4(1−x2 / r2)2 / 64D] in relation to the operating pressure for protection against maximum pressure p when the diaphragm has a radius of r, a thickness of t, and a flexural rigidity of D.

The single integrated sensor chip for temperature, humidity and pressure is manufactured by: on substrate, processing a parallel plate as the electrode of a capacitor for humidity and three resistances as the strain resistance and thermistor; preparing one layer of polymer on the plate and resistances as the capacitor dielectric medium and the elastic membrane respectively; arranging a grid plate on former dielectric medium as another capacitor electrode; forming a voltage-measuring bridge by resistances on pressure-sensitive membrane and substrate; vacuum sealing the cavity under the pressure-sensitive film to measure absolute pressure.

A thin plate-shaped six-axis force sensor chip comprising a semiconductor substrate formed by semiconductor film-forming processes, the sensor chip having through-holes formed therein and arranged so that the sensor chip is functionally divided by the through-holes into an action part to which an external force is applied, a support part to be fixed to an external structure, and a plurality of connecting parts each connecting together the action part and the support part and having a bridge portion of generally T-shaped configuration joined to the action part and an elastic portion joined to the support part. Each of the connecting parts has a plurality of strain resistance devices each comprising an active layer formed on at least one of front and rear faces thereof in an area thereof where deformation strain effectively occurs, the strain resistance devices being electrically connected to corresponding electrodes disposed in the support part.

A multi-axis sensor chip provided by the invention includes a semiconductor substrate having an action part having an external force action area part and non-deforming area parts, a support part supporting the action part, and connecting parts connecting the action part to the support part. The sensor chip also has strain resistance devices provided on deforming parts of the connecting parts and has temperature-compensating resistance devices provided on the non-deforming area parts. Temperature compensation is carried out exactly by means of the temperature-compensating resistance devices when an external force or a load acts on the action part, and highly accurate stress detection can be carried out.

There is provided a multi-axis force sensor including first and second bridge circuit groups detecting resistances of respective first and second groups of strain resistance elements provided at respective strain producing portions. The strain producing portions are formed on two axes intersecting with respect to each other at a right angle. The first group of strain resistance elements are arranged on one axis across an action portion so as to face with respect to each other, and the second group of strain resistance elements are arranged on another axis across the action portion so as to face with respect to each other. The first bridge circuit groups respectively output a positive voltage when receiving tensile force, and the second bridge circuit groups respectively output a negative voltage when receiving tensile force.

A multi-axis sensor chip provided by the invention includes a semiconductor substrate having an action part having an external force action area part and non-deforming area parts, a support part supporting the action part, and connecting parts connecting the action part to the support part. The sensor chip also has strain resistance devices provided on deforming parts of the connecting parts and has temperature-compensating resistance devices provided on the non-deforming area parts. Temperature compensation is carried out exactly by means of the temperature-compensating resistance devices when an external force or a load acts on the action part, and highly accurate stress detection can be carried out.

There is provided a multi-axis force sensor including first and second bridge circuit groups detecting resistances of respective first and second groups of strain resistance elements provided at respective strain producing portions. The strain producing portions are formed on two axes intersecting with respect to each other at a right angle. The first group of strain resistance elements are arranged on one axis across an action portion so as to face with respect to each other, and the second group of strain resistance elements are arranged on another axis across the action portion so as to face with respect to each other. The first bridge circuit groups respectively output a positive voltage when receiving tensile force, and the second bridge circuit groups respectively output a negative voltage when receiving tensile force.

Polymer microsphere thermal insulation dry powder paint is formed by raw material with following parts by weight of 20-40 water glass powder, 8-15 pore closed expansive perlite, 3-15 hollow glass or ceramic micro-bead, 10-30 polymer phase-change microsphere, 2-5 hollow fiber, 3-5 sodium fluosilicate, 5-10 emulsion powder and 5-10 water-proof anti-permeability addition agent, which shares the common characteristics of thermal resistance type and thermal capacity type materials, and has prominent weatherability and extremely excellent strain resistance. Hollow fiber provides excellent thermal insulation property, and largely increases the properties of pull-resistance, cracking resistance and breaking resistance at large amplitude. An excellent barrier layer is formed through the mutual gradation of hollow glass or ceramic micro-bead, hollow fiber and polymer microsphere and the like according to particle size, thereby largely increasing thermal insulating property. Dry powder supply is employed, which largely reduce transportation cost and storage cost, and is convenient for storing and transporting and construction.

The invention relates to a vertebral physiological curvature monitoring device. The device comprises a curvature sensor module, a central processing unit and a patch; the patch is made from flexible waterproof materials, and an adhesive is formed on one side of the patch, so that the patch sticks to the vertebral physiological curvature part of a subject; the curvature sensor module and the central processing unit are packaged in the patch; the curvature sensor module comprises at least two strain resistance type curvature sensors which are arranged in the length direction of the patch, and the output vertebral curvature information is transmitted to the central processing unit to be processed.

The invention discloses a transducer calibration method for a vehicle weighing system. The method mainly comprises the following steps that a strain resistance type analog transducer is arranged on an automobile axle, the transducer is calibrated, a calibration coefficient of the transducer is calculated by adopting nonlinear least squares based on L2 regularization, and cargo weight of a heavy-duty lorry is calculated according to an AD value output by the transducer and the calibration coefficient of the transducer. In the driving process of an automobile, stable cargo weight data with high precision also can be obtained through the transducer calibration method for the vehicle weighing system.

A force-on-pedal sensor of the present invention includes a cylindrical substrate (11) whose one end is closed having: a hole part (11d) at a center of its side section (11c); and a strain resistance element (13) via an insulating layer (12) at its side section (11c), a coil spring (15) coaxially inserted from an open end of the substrate (11), an inputting shaft having a stepped part (14a) contacted with one end of the coil spring (15) and inserted in the hole part (11d) in such a manner that a part of the inputting shaft (14) is protruded from the hole part (11d), and a stopper at a position where the inputting shaft (14) is protruded.

The present invention relates to a construction method of a high-strength prestressed concrete pipe pile. The method can be effectively used for the requirement of the construction of the high-rise building high strength prestressed concrete pipe pile and settles the problems of safety and stability in the high-rise building. The settling technical scheme is that the piling machine is arranged after measuring and wire arranging. When the precast pile is checked, the precast pile is hoisted with the piling machine. When the pile is stable, the precast pile is executed with pressing. After pressing, the pile splicing and pile feeding are executed. When the test pile is checked to be qualified, the piling machine can be transferred for the next cycle operation. The method of the invention is advanced and scientific and has the advantages of fast construction speed, easy operation, good quality, strong strain resistance, stability, safety, no environmental pollution and tremendous economic and social benefit.

A force sensor chip having a multiaxial force sensing function is disclosed. The force sensor chip comprises a base member having an operating part provided with an external force application area, a supporting part for supporting the operating part, connecting parts for connecting the operating part and the supporting part, and strain resistance elements disposed in the connecting parts or within boundaries between the connecting parts and the operating part. The base member has a thin area formed with a small thickness, and the boundaries of the thin area are disposed in the supporting part and operating part.

A force-on-pedal sensor of the present invention includes a cylindrical substrate (11) whose one end is closed having: a hole part (11d) at a center of its side section (11c); and a strain resistance element (13) via an insulating layer (12) at its side section (11c), a coil spring (15) coaxially inserted from an open end of the substrate (11), an inputting shaft having a stepped part (14a) contacted with one end of the coil spring (15) and inserted in the hole part (11d) in such a manner that a part of the inputting shaft (14) is protruded from the hole part (11d), and a stopper at a position where the inputting shaft (14) is protruded.

A force sensor chip which comprises: a base member, which includes an action portion to which an external force is applied through an attenuator, a support portion supporting the action portion, and a connection portion which connects the action portion and the support portion and deflects according to the applied external force; and a plurality of strain resistance elements which are arranged in the connection portion and detect the applied external force based on a deflection of the connection portion, wherein longitudinal directions of the plurality of the strain resistance elements are oriented in an identical direction.

In a force sensor chip, a semiconductor substrate includes: a plurality of operating parts each including an external-force acting area section and a non-deforming section; a supporting part for supporting the operating parts, and a plurality of connecting parts for connecting the operating parts and the supporting part. Strain resistance elements are provided on deformation-generating sections of the connecting parts. The plurality of operating parts are provided, in corresponding relation to the plurality of connecting parts, between the connecting parts and the supporting part.

The invention provides a high-temperature pressure and temperature compounded sensor and a preparation method thereof. The invention improves the structure of the previous patent of the inventor: silicon sapphire force sensor and the preparation method thereof. The manufacturing method comprises the following steps of manufacturing a platinum thermal resistor having same materials with a strain resistance leading-through platinum welding disc and a platinum welding disc of an internal leading-through at one corner of a non-stress area on a same sapphire wafer with a silicon strain resistor; adopting a welding metal foil strip to replace the original elastic metal contact or the internal leading-through in other forms, thus preparing the high-temperature pressure and temperature compoundedsensor with strong vibration resistance and large acceleration resistance. The method solves the problem that the high reliability can not be met when the pressure and the temperature are measured ata same point in the prior art. The high-temperature pressure and temperature compounded sensor remains the advantages of the existing silicon sapphire force sensor; furthermore, compared with the similar product, the high-temperature pressure and temperature compounded sensor has the advantages of more reasonable manufacturing technology, quick operation, low relative cost, high production efficiency and the like, and obviously improves the high reliability of the measurement under the severe conditions.

In a force sensor chip, a base member, to which an external force is applied, includes: an operating part provided in a central portion of the base member and having an external-force acting area section; a supporting part provided, in an outer peripheral portion of the base member, for supporting the operating part; an intermediate part provided between the operating part and the supporting part; a first connecting arm section connecting the operating part and the intermediate section; a second connecting arm section connecting the intermediate part and the supporting part; and at least one strain resistance element provided on each of respective deformation-generating portions of the first and the second connecting arm sections.

The invention discloses an egg yolk antibody for preventing novel goose astrovirus and a preparation method thereof. The egg yolk antibody contains a goose astrovirus strain resistance antibody; the preservation number of the goose astrovirus strain is CCTCC NO:V201808. The prepared egg yolk antibody is good in safety, and no any partial or whole adverse reaction is caused by the egg yolk antibody; infections caused by novel goose astrovirus can be effectively prevented and / or treated, and the good commercialization development prospect is achieved.

The invention discloses a cultivation method of broad-spectrum durable blast resistance rice, comprising the following steps: 1 a rice-blast resistance germplasm gene bank construction; 2 a basic colony construction; 3 intercross-shuttle selection- intercross; 4 pedigree shuttle high-pressure selection; 5 test cross identification; 6. start-point temperature identification; 7 resistance spectrum measurement, the germplasm material with complete group resistance frequency of above 90% to the known rice blast pathogene is kept to be broad-spectrum durable blast resistance rice. The broad-spectrum durable blast resistance rice is generated using group improvement technique, thus the rice has broad-spectrum persistent rice-blast resistance and copes with new rice-blast physiological strain resistance-gene and solves biparental homologous resistance of hybrid rice and linkage problem of resistance gene and disadvantageous gene, thus the broad-spectrum durable blast resistance rice of good quality can be obtained and both production and income can be increased.

A force sensor chip which comprises: a base member, which includes an action portion to which an external force is applied through an attenuator, a support portion supporting the action portion, and a connection portion which connects the action portion and the support portion and deflects according to the applied external force; and a plurality of strain resistance elements which are arranged in the connection portion and detect the applied external force based on a deflection of the connection portion, wherein longitudinal directions of the plurality of the strain resistance elements are oriented in an identical direction.

A force sensor chip including a semiconductor substrate having a plurality of strain resistance elements and temperature-compensating resistance elements corresponding to the resistance elements is disclosed. The structure in the periphery of parts where the strain resistance elements, which are provided to deforming parts in the action part formed on the semiconductor substrate, are disposed is the same as the structure in the periphery of parts where the temperature-compensating resistance elements in the action part are disposed.

A force sensor chip having a multiaxial force sensing function is disclosed. The force sensor chip comprises a base member having an operating part provided with an external force application area, a supporting part for supporting the operating part, connecting parts for connecting the operating part and the supporting part, and strain resistance elements disposed in the connecting parts or within boundaries between the connecting parts and the operating part. The base member has a thin area formed with a small thickness, and the boundaries of the thin area are disposed in the supporting part and operating part.

The invention particularly relates to an environment-friendly FEVE (trifluorochloroethylene copolymer) fluorocarbon coating and a preparation method thereof. The environment-friendly FEVE fluorocarbon coating is prepared from, by weight, 20-30 parts of an FEVE emulsion, 20-30 parts of epoxy-based silane modified silica sol, 1.0-2.0 parts of a coalescing agent, 0.1-1.0 part of a viscosifier, 0.2-1.0 part of a polyurethane thickening agent and 30-60 parts of color paste; the color paste is prepared from, by weight, 33% of water, 0.3% of a multifunctional agent, 0.3% of a cellulosic thickener, 0.4% of a wetting agent, 0.9% of a dispersing agent, 0.1% of a defoamer, 47% of titanium dioxide, 9% of mica powder and 9% of wollastonite powder. The environment-friendly FEVE fluorocarbon coating is free from organic solvents of benzene, methylbenzene, xylene, ethylbenzene and the like and harmful substances like free diisocyanate to human bodies and environment, excellent in alkali resistance, water resistance, aging resistance, corrosion resistance, washability, adhesive force and strain resistance and broad in market prospect.

Building integrated photovoltaic (BIPV) systems provide for solar panel arrays that can be aesthetically pleasing to an observer. BIPV systems can be incorporated as part of roof surfaces as built into the structure of the roof, particularly as roofing modules that have photovoltaic elements embedded or incorporated into the body of the module, in distinct tiles-sized areas. The use of modules that replicate the look of individual roofing tiles (or shingles) can lead to a more efficient installation process. Further, modules can include flexible joints between the distinct tiles-sized areas, across which solar cells within the module are electrically connected. The flexibility granted to the modules also makes installation easier, and further improves the fatigue and strain resistance of the overall solar array for its operational life.

The invention discloses a nano-mesoporous titanium dioxide anticorrosive coating which comprises the following components in parts by weight: 35-45 parts of water-borne epoxy resin emulsion, 10-20 parts of nano-mesoporous silicon dioxide particles, 5-15 parts of nano titanium dioxide, 2-8 parts of dispersant, 3-9 parts of plasticizer, 2-12 parts of coalescing agent, 4-10 parts of thickening agent and 25-35 parts of deionized water. The nano-mesoporous titanium dioxide anticorrosive coating disclosed by the invention has excellent antibacterial and anticorrosive performance, high surface strain resistance and good weather resistance; and without organic solvents, the nano-mesoporous titanium dioxide anticorrosive coating is environment-friendly and non-toxic, avoids harm to the environment and human bodies, and is applicable to anticorrosive treatment on the metal surfaces of steel, aluminum products and the like.