30results about How to "Reduce packaging steps" patented technology

The invention discloses an inorganic hydrated salt porous carbon composite phase change material and a preparation method thereof, wherein the preparation method comprises the following steps: firstly, preparing biomass-based porous carbon subjected to activation treatment, and weighing an inorganic hydrated salt phase change material, the biomass-based porous carbon and a pore sealing agent in proportion; and then preparing a saturated solution from the inorganic hydrated salt phase change material, adding biomass-based porous carbon, impregnating, carrying out vacuum pressurization and adsorbing; and finally, adding the pore sealing agent, stirring, wind-drying, and grinding and pulverizing, to obtain the inorganic hydrated salt porous carbon composite phase change material. The composite phase change material prepared by the method has the advantages of difficult liquid leakage, no phase separation, small supercooling degree, high phase change enthalpy, no toxicity, no corrosion, good thermal stability, good durability, low preparation cost and the like, and has broad market prospects in the fields of building and energy-storage materials.

The invention discloses a waterproof packaging structure and a packaging method of a large-dimensional photomultiplier. The waterproof packaging structure comprises a tray matched with the bottom shape of a glass shell of the photomultiplier, a sleeve, a cable waterproof connector and a bottom cover, wherein a hole is formed in the tray; the bore diameter of the hole is consistent to the inner diameter of the sleeve; the tray is connected with one end of the sleeve in a sealing manner through the hole; the other end of the sleeve is fixedly connected with the bottom cover; the tray and the bottom of the glass shell of the photomultiplier are connected in a sealing manner; and one end of the cable waterproof connector is connected with the cable inlet of the sleeve in a sealing manner while the other end is connected with a cable. According to the waterproof packaging structure and the packaging method, the packaging steps are less and the demand on an operator is relatively low; and more importantly, the waterproof packaging structure can be detached, so that problem checking and changing and upgrading of a PMT voltage divider can be realized.

The invention discloses anti-phosphor deposition high thixotropic LED (light-emitting diode) jelly glue. By selecting a coupling agent and optimizing hydrolysis conditions, a thixotropic material is obtained by modifying a gas phase, namely silicon dioxide, and anti-deposition phosphor is obtained by modifying phosphor. The thixotropic material is added into a silica gel system to obtain a high thixotropic silica gel system with a thixotropic index which is as high as 5; by adding different types and different contents of modified phosphor into the system, the jelly glue with different color temperatures can be integrally mixed, the jelly glue can not produce deposition within a shelf life of 3 months, and the color temperature value after packaging can be kept unchanged. The jelly glue disclosed by the invention is packaged by a needle cylinder, a mold is not required for assistance, the jelly glue can be directly fixed on a dispensing machine for use, and automatic forming is performed after dispensing. According to the jelly glue disclosed by the invention, the phosphor and the silica gel system are combined into a whole to prepare the jelly glue, the mold packaging step of an LED packaging link can be eliminated, the downstream packaging process is simplified, the production period is shortened, and the production efficiency is improved, so that the jelly glue has good application prospects.

The invention discloses a two-temperature phase-change temperature-variable swelled vermiculite plate and a preparation method thereof. The plate comprises the following raw materials: a kieselguhr phase-change composite material, a swelled vermiculite composite phase-change material, Portland cement and a water reduction agent, wherein the kieselguhr phase-change composite material has a phase-change temperature of 5-15DEG C, and latent heat of phase change is greater than or equal to 30 J / g; the swelled vermiculite composite phase-change material has a phase-change temperature of 25-40 DEG C, and the latent heat of phase change is greater than or equal to 80J / g. The kieselguhr phase-change composite material, the swelled vermiculite composite phase-change material, the Portland cement and the water reduction agent are uniformly stirred with water at a mass ratio of (10-30):(20-40):(30-60):(0.2-0.6):(20-40), and the mixture is cast, molded, maintained for two days and then demoulded to obtain the plate. According to the plate prepared with the method disclosed by the invention, micropore adsorption functions of swelled vermiculite and kieselguhr on phase-change materials are sufficiently taken into play, and structure-function integration of a building material is achieved while temperature adjustment efficiency is ensured; in addition, the plate can be cost in situ and playsroles in both winter and summer, and compared with other plates, the plate has a wider application range.

The invention relates to a carton box comprising a body, an upper cover and a lower cover, wherein the upper cover comprises a first upper cover, a second upper cover and a third upper cover, the lower cover comprises a first lower cover, a second lower cover, a third lower cover and a fourth lower cover, double-faced adhesive tapes are both coated on the inner sides of the first lower cover and the third lower cover, the widths of the first upper cover and the third upper cover are both a half of the width of the body, the widths and the lengths of three sides of the second upper cover are all greater than the length and the width of the body, a double-faced adhesive tape is arranged on a paperboard of the third upper cover, wherein the paperboard is greater than the body. A multilayer bottom plate is formed on the lower cover of the carton box so that the firmness of the bottom plate of the original carton box is increased, and the service life of the carton box is also prolonged; generating gaps in the folded positions of the upper cover of the carton box is avoided; and the upper cover and the lower cover both adopt the double-faced adhesive tape design for replacing adhesive tape paper so that the packaging steps of a product are reduced and the working efficiency is increased.

The invention is concerned with the encapsulation method that can improve image sensing wafer structured on the circuit board, it is: provides a module group circuit base-board that the surface of it is with numbers of pin and module group circuit, sets a image sensing wafer, the line of the image sensing wafer forms electrical connection with each pin; covers a camera lens base on the top of the image sensing wafer, glues on the circuit base-board; sets the camera lens groupware within a lens on the top of the camera lens base, adjusts the focus between the lens and the image sensing wafer; seals the camera lens groupware by the pastern and forms aeroseal at the joint part of the camera lens base, finishes the encapsulation of the image getting module.

The invention discloses a super capacitor comprising a capacitor body, two outside-of-group tabs and an outer package, wherein the capacitor body is provided with a first end and a second end and comprises a plurality of single-cell capacitors, the plurality of single-cell capacitors are connected in series and / or in parallel, the first end is connected with a first single-cell capacitor in the plurality of single-cell capacitors, the second end is connected with a last single-cell capacitor in the plurality of single-cell capacitors, one of the two outside-of-group tabs is connected with the first end while the other of the outside-of-group tabs is connected with the second end, and the outer package is used for packaging the capacitor body. The super capacitor can be used for effectively reducing device thickness and packaging steps, and the super capacitor is simple in structure and easy to implement.

The invention discloses a concentrating photovoltaic solar device. The concentrating photovoltaic solar device comprises a reflecting mirror structure (2), a photovoltaic cell device (6), a radiator (11) and a cover lens (5), wherein the reflecting mirror structure (2) comprises a reflecting mirror (3); the photovoltaic cell device (6) is respectively arranged on the special position of the reflecting mirror structure (2) for directly receiving light rays converged by the corresponding reflecting mirror (3); the arranged position of the radiator (11) does not affect a reflecting light path, and is close to or partly superposed with the reflecting mirror structure (2); the cover lens (5) is arranged in front of the reflecting mirror structure (2), wherein the reflecting mirror structure (2) and the cover lens (5) form a closed space; and the photovoltaic cell device (6) is arranged in the closed space. The concentrating photovoltaic solar device has reliable performance, is high in strength, low in cost and long in service life, and can be installed in the form of an array, and can be applied in a large-scale manner.

The invention provides an integrated cut and imprinted sliding double-layer packing box. The integrated cut and imprinted sliding double-layer packing box comprises a box body and a box cover. The boxbody is internally provided with an inner box. The inner box rotates on the plane determined through an inner box bottom plate with the side edge of a rear plate as an axis. A box frame is placed inthe inner box. The box frame is of a cuboid structure. The upper surface of the box frame is provided with a set of box groove imprints. Meanwhile, the invention provides an anti-counterfeit packing method, and the anti-counterfeit packing method comprises the steps that the box body, the box cover and the box frame are manufactured; the upper surface of the box frame is subjected to cutting and imprinting by using a mold to form the box groove imprints; anti-counterfeit ink is printed on the box groove imprints, an object box is placed on the box frame when the anti-counterfeit ink is not dried and is pressed downwards after the anti-counterfeit ink is dried completely, so that cut marks of the box groove imprints crack, and folding is conducted along impressions to form a box groove, andfinally, the object box sinks into the box groove; and the sliding double-layer packing box is sealed and packed. The integrated cut and imprinted sliding double-layer packing box is novel in structure and simple in process, and anti-counterfeit packing can be achieved.

The invention discloses a highly thixotropic LED jelly glue for preventing fluorescent powder from settling. In the present invention, by optimizing the coupling agent and optimizing the hydrolysis conditions, the fumed silicon dioxide is modified to obtain a thixotropic material, and the fluorescent powder is modified to obtain an anti-sedimentation fluorescent powder. Add thixotropic materials to the silica gel system to obtain a highly thixotropic silica gel system with a thixotropic index of up to 5; adding different types and different contents of modified phosphors to the system can integrate jelly gels with different color temperatures. There will be no sedimentation during the 3-month warranty period, and the color temperature value will remain unchanged after packaging. The jelly glue of the present invention is packaged in a syringe without mold assistance, can be directly fixed on a glue dispensing machine for use, and is automatically formed after dispensing. The invention combines the fluorescent powder and the silica gel system to prepare the jelly glue, which can save the mold packaging step in the LED packaging link, simplify the downstream packaging process, shorten the production cycle, improve the production efficiency, and have good application prospects.

Products having sensitive regions, such as information handling system components have electrical connections or openings, are packaged with the sensitive region sealed. A sealing portion on the inner surface of a wrapper has an adhesive surface that adheres the wrapper to the sensitive region so that the wrapper encloses the product with the sensitive portion sealed. For instance, an ink jet cartridge printhead adheres to the sealing portion so that enclosing the cartridge in the wrapper packages the cartridge with the printhead sealed. Removal of the wrapper from the cartridge exposes the printhead for use in an inkjet printer.

The invention discloses a paper box which comprises a body (1), an upper cover (2) and a lower cover (3), wherein the upper cover (2) comprises a first upper cover (2-1), a second upper cover (2-2) and a third upper cover (2-3); the lower cover (3) comprises a first lower cover (3-1), a second lower cover (3-2), a third lower cover (3-3) and a fourth lower cover (3-4). The paper box is characterized in that the inner sides of the first lower cover (3-1) and the third lower cover (3-3) are both coated with double-faced adhesives (4); the widths and the lengths of the three edges of the second upper cover (2-2) are greater than the lengths and the widths of the body (1); the double-faced adhesive (4) is arranged on a paper board of a part of the second upper cover (2-2), larger than the body. According to the paper box, the overall strength of a bottom cover can be enhanced, the service life can be prolonged, the workload can be reduced, and the box sealing efficiency can be improved.

The invention discloses a power device and an assembling method of the power device. The power device comprises metal media, at least one device body and at least one unpacked chip, the metal media are arranged in a substrate to be assembled, the at least one device body is arranged on the substrate to be assembled, the at least one unpacked chip is arranged on the metal media, and the at least one unpacked chip is electrically connected with the at least one device body.

The invention relates to an electrochromic display panel and electronic paper. The display panel comprises a first substrate, an electrochromic pixel array and a second substrate which are arranged insequence, the electrochromic pixel array comprises a plurality of electrochromic units which are arranged in an array and are independently controlled, and each electrochromic unit comprises a firstelectrode, an electrochromic layer and a second electrode which are arranged in sequence; the first electrode is provided with a first opposite surface opposite to the second electrode, the second electrode is provided with a second opposite surface opposite to the first electrode, and a plurality of micro-nano structures are arranged on the first opposite surface and / or the second opposite surface. According to the electrochromic display panel and the electronic paper, micro-nano structures are arranged on the first electrodes and / or the second electrode in the electrochromic pixel array, thecontact area can be increased, better electrochemical performance is achieved, the electric field distribution between the two electrodes is more uniform, the conductive effect and the response speedare enhanced, the structure is simple, and the preparation is easy.

The invention relates to an electrochromic display panel and electronic paper. The display panel comprises a first substrate, an electrochromic pixel array and a second substrate which are arranged insequence. The electrochromic pixel array comprises a plurality of electrochromic units that are arranged in an array mode and are independently controlled; wherein each electrochromic unit comprisesa black structure layer and a color structure layer, the black structure layer comprises a first electrode, a black electrochromic pixel layer and a second electrode which are sequentially arranged, the color structure layer comprises a plurality of red, green and blue optical filters which are transversely and horizontally arranged, and the color structure layer is arranged on one side of the black structure layer. The electrochromic display panel and the electronic paper not only can display black, but also can display other colors, the display colors are rich, the structure is simple, the preparation is easy, the production cost is saved, and the product quality is improved.

The invention provides an integrated cut and imprinted sliding double-layer packing box. The integrated cut and imprinted sliding double-layer packing box comprises a box body and a box cover. The boxbody is internally provided with an inner box. The inner box rotates on the plane determined through an inner box bottom plate with the side edge of a rear plate as an axis. A box frame is placed inthe inner box. The box frame is of a cuboid structure. The upper surface of the box frame is provided with a set of box groove imprints. Meanwhile, the invention provides an anti-counterfeit packing method, and the anti-counterfeit packing method comprises the steps that the box body, the box cover and the box frame are manufactured; the upper surface of the box frame is subjected to cutting and imprinting by using a mold to form the box groove imprints; anti-counterfeit ink is printed on the box groove imprints, an object box is placed on the box frame when the anti-counterfeit ink is not dried and is pressed downwards after the anti-counterfeit ink is dried completely, so that cut marks of the box groove imprints crack, and folding is conducted along impressions to form a box groove, andfinally, the object box sinks into the box groove; and the sliding double-layer packing box is sealed and packed. The integrated cut and imprinted sliding double-layer packing box is novel in structure and simple in process, and anti-counterfeit packing can be achieved.

The invention relates to an encapsulation structure of a conductor frame without external pins. The encapsulation structure comprises a conductor frame without external pins, a chip and encapsulation material. The conductor frame without external pins consists of a framework and a chip seat. The framework is provided with a plurality of guiding and connecting parts, and a first depression part is arranged in the inner side part of the guiding and connecting parts. The chip seat is provided with a second depression part which is formed around the chip seat. The second depression part of the invention can inhibit problems like pollution and uneven surface caused by overflow of resin when the chip is arranged on the chip seat. Furthermore, the encapsulation structure of the invention requires no use of pad higher plates arranged between the chip and the chip seat, so as to reduce encapsulation steps and manufacturing cost.

The invention provides an integrally cut and impressed double-layer packaging box which comprises a box body and a box cover. An upper inner box body and a drawer-type lower inner box body are arranged in the box body. A box holder is placed in the upper inner box body and / or the lower inner box body. The upper surface of the box holder is provided with box slot impressing marks. The invention further provides an anti-counterfeit packaging method. The anti-counterfeit packaging method comprises the steps that the box body and the box cover are manufactured at first; then the box holder is manufactured, and the box slot impressing marks are formed on the upper surface of the box holder through a mold in cutting and impressing modes; anti-counterfeit ink is printed on the box slot impressingmarks, and an article box is put on the box holder before the anti-counterfeit ink is dry, and is pressed down after the anti-counterfeit ink is completely dry, so that a box slot is formed, and finally the article box sinks into the box slot; and finally packaging is conducted. The integrally cut and impressed double-layer packaging box is novel in structure and can be manufactured through simple technical steps, the manufacturing cost is reduced, the box can be used for anti-counterfeit packaging at the same time, and the value of non-commercial behavior recycling can be improved.

The invention discloses a blueberry residue dietary fiber date cake, and a preparation method thereof. The blueberry residue dietary fiber date cake is prepared from, by weight, 1 to 2 parts of red date, 0.075 to 0.15 parts of gelatine powder, 0.1 to 0.2 part of sugar, 3 to 5 parts of yoghourt, 0.08 to 0.16 part of blueberry residue powder, and 5 to 10 parts of water. The blueberry residue dietaryfiber date cake is excellent in mouthfeel, and low in calories, is simple to prepare; full utilization of blueberry residue nutritional value is realized; and fruit residue recycling rate is increased.

The invention discloses a fingerprint identification chip package structure. A groove is arranged in a non-functional area on a first surface of a fingerprint identification chip, an ASIC chip is arranged in the groove, and the fingerprint identification chip and the ASIC chip are electrically connected through a redistribution layer (RDL); and the fingerprint identification chip and the ASIC chipintegrated into one package body. As a result, the packaging steps are reduced, the production efficiency is increased, the packaging volume is reduced, the manufacturing cost is also greatly reduced, and the product performance is improved at the same time.

The invention relates to an electrochromic display panel and electronic paper. The electrochromic display panel comprises a first substrate, an electrochromic pixel array and a second substrate whichare arranged in sequence. The electrochromic pixel array comprises a plurality of electrochromic units that are in array arrangement and are independently controlled. Each electrochromic unit comprises a black structure layer and a color structure layer, the black structure layer comprises a first electrode, a black electrochromic pixel layer and a second electrode which are sequentially arranged,the color structure layer is arranged on one side of the black structure layer, and the color structure layer comprises RGB structure units or RGBW structure units which are transversely arranged; wherein the first electrode is provided with a first opposite side opposite to the second electrode, the second electrode is provided with a second opposite side opposite to the first electrode, and a plurality of micro-nano structures are arranged on the first opposite side and / or the second opposite side. The electrochromic display panel and the electronic paper not only can display black, but also can display other colors, and the electric field distribution between the transparent electrodes is uniform, so that the electrochromic display panel and the electronic paper have a good display effect.

The invention relates to a flip LED chip and a packaging method thereof. The invention relates to the related field of LED technology, and mainly relates to a flip chip, a heat radiation base and substrates. The flip LED chip includes a transparent substrate, an N type GaN layer, a carrier composite layer, and a P type GaN layer which are superposed in sequence. An N type electrode, a P type electrode and an insulating layer which separate the N type electrode and the P type electrode are manufactured on the surface of the chip. The substrates are made of various materials, and each substrate contains a metal connection point and a circuit connected with the outside. The electrodes of the chip can adopt various methods to be connected with the metal connection points of the substrates to manufacture a light emitting diode, and the light emitting diode is put into a housing coated with fluorescent powder to obtain a light emitting device. The light emitting device obtained by the invention has the characteristics of high power, good heat radiation effect, optimized packaging technology, saved production cost and the like.

The invention discloses a packaging method, an MEMS microphone and a packaging structure thereof. The packaging structure comprises: a printed circuit board, a micro-electromechanical structure used for bearing the MEMS microphone, a chip structure, and a three-dimensional circuit structure, wherein the peripheral edge extends in the thickness direction of the three-dimensional circuit structure,the three-dimensional circuit structure forms an accommodating cavity, and the accommodating cavity is provided with an opening in the thickness direction, wherein the printed circuit board is fixed with the three-dimensional circuit structure, so that the opening is covered by the printed circuit board, the micro-electromechanical structure and the chip structure are accommodated in the accommodating cavity, and the packaging structure can reduce the packaging steps of the MEMS microphone, thereby improving the packaging efficiency and yield of the MEMS microphone.

The invention belongs to the technical field of agricultural and sideline product processing, and particularly discloses a selenium-rich rice bran enzyme deactivation stabilizing treatment method, which comprises the following steps: putting rice bran into a high-temperature-resistant plastic bag, semi-sealing the plastic bag, and reserving an air outlet hole of 1-10 cm; flatly putting the baggedrice bran into microwave equipment, flattening the rice bran, starting the microwave equipment, and carrying out enzyme deactivation treatment through microwave heating; and then sending the rice branout of microwave equipment, sealing the plastic bag while the rice bran is hot, and finally sending the bagged rice bran into a low-temperature warehouse for cooling. According to the invention, a microwave rapid heating mode and a damp-heat treatment mode are combined, a semi-sealed plastic bag mode is innovatively adopted, damp-heat steam generated by microwave heating of rice bran is ingeniously utilized, and the technical defects of low heat efficiency utilization, non-uniform material temperature and non-uniform and non-stable enzyme deactivation effect of traditional microwave treatmentof rice bran are overcome; the invention provides the rice bran enzyme deactivation stabilization method which is simple in process, high in production efficiency, small in equipment investment and suitable for medium millet factories.

The invention discloses a dual-temperature phase change temperature-regulating expanded vermiculite board and a preparation method thereof. The raw materials of the plate include diatomite phase change composite material, expanded vermiculite composite phase change material, portland cement and water reducer. The phase change temperature of the diatomite phase change composite material is 5-15°C, and the latent heat of phase change is ≥30J / g; the phase change temperature of the expanded vermiculite composite phase change material is 25-40°C, and the latent heat of phase change is ≥80J / g. Stir the diatomite phase change composite material, expanded vermiculite composite phase change material, portland cement, water reducer and water according to the mass ratio of 10~30:20~40:30~60:0.2~0.6:20~40 After uniform pouring, it can be demoulded after 2 days of curing. The plate prepared by the invention fully utilizes the micropore adsorption effect of expanded vermiculite and diatomite on phase change materials, and realizes the structural and functional integration of building materials while ensuring the temperature adjustment efficiency; in addition, the plate can be poured on site It works in both winter and summer, and has a wider range of applications than other boards.

The invention discloses a concentrating photovoltaic solar device. The concentrating photovoltaic solar device comprises a reflecting mirror structure (2), a photovoltaic cell device (6), a radiator (11) and a cover lens (5), wherein the reflecting mirror structure (2) comprises a reflecting mirror (3); the photovoltaic cell device (6) is respectively arranged on the special position of the reflecting mirror structure (2) for directly receiving light rays converged by the corresponding reflecting mirror (3); the arranged position of the radiator (11) does not affect a reflecting light path, and is close to or partly superposed with the reflecting mirror structure (2); the cover lens (5) is arranged in front of the reflecting mirror structure (2), wherein the reflecting mirror structure (2) and the cover lens (5) form a closed space; and the photovoltaic cell device (6) is arranged in the closed space. The concentrating photovoltaic solar device has reliable performance, is high in strength, low in cost and long in service life, and can be installed in the form of an array, and can be applied in a large-scale manner.

The invention discloses a waterproof packaging structure and a packaging method of a large-dimensional photomultiplier. The waterproof packaging structure comprises a tray matched with the bottom shape of a glass shell of the photomultiplier, a sleeve, a cable waterproof connector and a bottom cover, wherein a hole is formed in the tray; the bore diameter of the hole is consistent to the inner diameter of the sleeve; the tray is connected with one end of the sleeve in a sealing manner through the hole; the other end of the sleeve is fixedly connected with the bottom cover; the tray and the bottom of the glass shell of the photomultiplier are connected in a sealing manner; and one end of the cable waterproof connector is connected with the cable inlet of the sleeve in a sealing manner while the other end is connected with a cable. According to the waterproof packaging structure and the packaging method, the packaging steps are less and the demand on an operator is relatively low; and more importantly, the waterproof packaging structure can be detached, so that problem checking and changing and upgrading of a PMT voltage divider can be realized.