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Microgravity environment-based spray cooling loop device

A spray cooling and microgravity technology, which is applied in cooling/ventilation/heating transformation, transportation and packaging, space navigation equipment, etc., to achieve the effect of occupying a small space, simple structure and reducing energy consumption

Inactive Publication Date: 2012-06-27
BEIHANG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] With the ever-changing space environment of spacecraft operation and the development of giantization and miniaturization of spacecraft, the thermal control system is faced with the challenges of high heat flow, small size, high temperature control accuracy and temperature uniformity, high reliability, large-area heat collection, deep Challenges such as heat transfer in low temperature and high temperature areas, the heat flux density of some high-power components used has reached 50W / cm 2 , and even reach 200W / cm in the foreseeable future 2 , the traditional heat dissipation technology has been unable to meet the requirements of new technology conditions

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Embodiment Construction

[0039] The spray cooling circuit device based on the microgravity environment of the present invention will be described in detail below with reference to the accompanying drawings.

[0040] see figure 1 , Figure 1A , Figure 1B As shown, the spray cooling circuit device based on the microgravity environment of the present invention includes a spray assembly 1, a hydraulic drive pipeline 2, a liquid storage assembly 3, a heat sink 4, a steam collection pipeline 5, a liquid collection first pipeline 6, a liquid The second collection pipe 61 and the liquid collector 7 are arrayed holes; the structure of the first liquid collection pipe 6 is the same as that of the second liquid collection pipe 61 .

[0041] (1) Spray assembly 1

[0042] see figure 1 , Figure 1A , Figure 1B , image 3 , Figure 5 As shown, the spray assembly 1 in the present invention includes a spray chamber 1B, a spray chamber cover plate 1A, a heat source 11 , a first capillary core 12 and an atomiz...

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Abstract

The invention discloses a microgravity environment-based spray cooling loop device. According to the device, a heat sink is arranged on a liquid storage component; a hydraulic driving pipeline is provided with a micro high pressure diaphragm pump; two ends of the hydraulic driving pipe are communicated with a liquid collector and a spray component respectively; three hole drain pipes of the liquid collector are inserted into a second capillary core of the liquid storage component; and the spray component and the liquid storage component are connected through a steam collecting pipeline, a first liquid collecting pipeline and a second liquid collecting pipeline. The device generates high-speed atomized liquid drops under high pressure impact, and the high speed atomized liquid drops impact the surface of the first capillary core connected with a heat source to take away heat generated by the heat source in heat transfer modes such as forced convection, boiling, evaporation phase change and the like. By the capillary characteristics of the capillary core, the device collects and circulates the liquid under microgravity environment; and moreover, a steam collector, a steam condenser and the liquid collector are integrated into a unit, so the volume is reduced.

Description

technical field [0001] The invention relates to a spray cooling circuit device suitable for spacecraft, more particularly to a spray cooling circuit device based on a microgravity environment. Background technique [0002] With the ever-changing space environment of spacecraft operation and the development of giantization and miniaturization of spacecraft, the thermal control system is faced with the challenges of high heat flow, small size, high temperature control accuracy and temperature uniformity, high reliability, large-area heat collection, deep Challenges such as heat transfer in low temperature and high temperature areas, the heat flux density of some high-power components used has reached 50W / cm 2 , and even reach 200W / cm in the foreseeable future 2 , the traditional heat dissipation technology can no longer meet the requirements of new technology conditions. [0003] Spray cooling technology uses nozzles to atomize the liquid into micron-scale droplets, which di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B64G1/22H05K7/20
Inventor 李运泽王瑾王浚张红生李淼
Owner BEIHANG UNIV
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