Embodiments of the invention generally provide an apparatus and method for replenishing 
organic molecules in an 
electroplating bath. The replenishment process of the present invention may occur on a real-time basis, and therefore, the concentration of organics minimally varies from desired concentration levels. The replenishment method generally includes conducting pre-
processing depletion measurements in order to determine organic depletion rates per 
current density applied in the 
electroplating system. Once the organic depletion rates per 
current density are determined, these depletion rates may be applied to an 
electroplating processing recipe to calculate the volume of organic depletion per 
recipe step. The calculated volume of organic depletion per 
recipe step may then be used to determine the volume of organic molecule replenishment per 
unit of time that is required per recipe step in order to maintain a desired concentration of organics in the plating solution. The calculated replenishment volume may then be added to the 
processing recipe so that the replenishment process may occur at real-time during processing periods. The apparatus generally includes a selectively actuated valve in communicaiton with a fluid delivery line, wherein the valve is configured to fluidly isolate a plating 
cell during a non-processing time period. The valve may be controlled by a 
system controller, and thus, the 
fluid level in the 
cell may be controlled during a non-processing time period.