The invention discloses a displacement type electroless 
gold plating solution, which comprises monopotassium citrate monohydrate bis(
malononitrile alloy (I)), a conductive compound, a 
buffering agent, a shielding complexing agent, a 
nickel oxidation remover and water.  The 
nickel oxidation remover is one or more of 
diethylenetriamine, pentamethyldiethylenetriamine, 
triethylenetetramine, hexamethyltriethylenetetramine and tetraethylenepentamine.  The present invention provides the source of gold ions with 
potassium citrate monohydrate (
malononitrile alloy (I)) as the displacement type chemical 
gold plating solution, thus does not need to use 
potassium gold 
cyanide as the gold source compound, and is an 
environmentally friendly displacement chemical  
Gold plating solution.  Since the substrate 
metal is easily corroded in the 
electroless plating solution of the displacement type to produce more 
nickel oxides, the 
nickel oxide remover is used to remove the 
nickel oxides on the surface of the substrate 
metal.  Experimental results show that the uniformity of the plating film formed by using the displacement type chemical 
gold plating solution provided by the invention is good, the 
grain boundary has no 
corrosion condition, and the solder wettability is good.