The invention relates to a lead-free 
solder alloy for 
welding the electronic elements and its manufacturing method. The lead-free 
solder alloy is characterized in that the main components are Sn, Ag, Cu, and Ni, and In, Bi, Pd, P, Ge, Ga, Se, Te, La, Ce, Pr, Nd, Pm, Sm, Eu, Tm are added selectively. The preparation method is characterized by taking Sn, Ag, Cu, Ni and the additional elements in proportion and 
smelting them at the temperature of 1300 C. to 1500 C. to obtain the intermediate 
alloy by using water glass covering process; melting the residual Sn and the intermediate 
alloy at the temperature of 300 C. to 350 C. by using water glass covering process, and 
casting the molten materials into 
alloy pig and 
soldering tin rod at the temperature of between 250 C. and 350 C.. The lead-free 
solder alloy provided by the invention can be used for 
welding the Ag and Pd 
noble metal electronic element.